Stroobandt dirk (34 resultados)
Applied Reconfigurable Computing. Architectures, Tools and Applications : 21st International Symposium, Arc 2025, Seville, Spain, April 9?11, 2025, Proceedings
Giorgi, Roberto (EDT); Stojilovic, Mirjana (EDT); Stroobandt, Dirk; Brox Jimenez, Piedad (EDT); Barriga Barros, Ángel (EDT)
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Librería: GreatBookPrices, Columbia, Estados Unidos de AmericaGreatBookPrices
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Applied Reconfigurable Computing. Architectures, Tools and Applications : 21st International Symposium, Arc 2025, Seville, Spain, April 9?11, 2025, Proceedings
Giorgi, Roberto (EDT); Stojilovic, Mirjana (EDT); Stroobandt, Dirk; Brox Jimenez, Piedad (EDT); Barriga Barros, Ángel (EDT)
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Librería: GreatBookPrices, Columbia, Estados Unidos de AmericaGreatBookPrices
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EUR 85,55
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Librería: BOOKWEST, Phoenix, Estados Unidos de AmericaBOOKWEST
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EUR 84,91
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Hardcover. Condición: New. SHRINK-WRAPPED: US SELLER SHIPS FROM USA.
Applied Reconfigurable Computing. Architectures, Tools and Applications : 21st International Symposium, Arc 2025, Seville, Spain, April 9?11, 2025, Proceedings
Giorgi, Roberto (EDT); Stojilovic, Mirjana (EDT); Stroobandt, Dirk; Brox Jimenez, Piedad (EDT); Barriga Barros, Ángel (EDT)
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 73,06
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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EUR 78,86
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Condición: New. In.
Applied Reconfigurable Computing. Architectures, Tools and Applications : 21st International Symposium, Arc 2025, Seville, Spain, April 9?11, 2025, Proceedings
Giorgi, Roberto (EDT); Stojilovic, Mirjana (EDT); Stroobandt, Dirk; Brox Jimenez, Piedad (EDT); Barriga Barros, Ángel (EDT)
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 86,52
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Librería: Books Puddle, New York, Estados Unidos de AmericaBooks Puddle
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EUR 111,40
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 118,76
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Paperback. Condición: Brand New. 240 pages. 9.25x6.10x9.21 inches. In Stock.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 80,24
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 9 11, 2025. The 12 full papers presented in this b…ook together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research.
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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EUR 164,32
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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EUR 164,32
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Librería: moluna, Greven, Alemaniamoluna
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EUR 136,16
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Librería: moluna, Greven, Alemaniamoluna
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EUR 136,16
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Gebunden. Condición: New.
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Librería: Books Puddle, New York, Estados Unidos de AmericaBooks Puddle
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EUR 212,27
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Condición: New. pp. 328.
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 201,92
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Condición: New. The design of digital (computer) systems requires several design phases. This book aims to develop a priori wire length estimation methods that can help the designer in finding a good lay-out of a circuit in less iterations of physical design steps and that are useful to compare different physical architectures.…Num Pages: 298 pages, biography. BIC Classification: TBD; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 636. . 2001. Hardback. . . . .
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 168,73
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both…performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 168,73
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting factor for both perform…ance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.
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Librería: Revaluation Books, Exeter, Reino UnidoRevaluation Books
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EUR 234,26
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Paperback. Condición: Brand New. reprint edition. 320 pages. 9.25x6.10x0.74 inches. In Stock.
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Librería: Kennys Bookstore, Olney, Estados Unidos de AmericaKennys Bookstore
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EUR 253,73
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Condición: New. The design of digital (computer) systems requires several design phases. This book aims to develop a priori wire length estimation methods that can help the designer in finding a good lay-out of a circuit in less iterations of physical design steps and that are useful to compare different physical architectures.…Num Pages: 298 pages, biography. BIC Classification: TBD; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 636. . 2001. Hardback. . . . . Books ship from the US and Ireland.
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Librería: Mispah books, Redhill, Reino UnidoMispah books
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EUR 312,31
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Hardcover. Condición: Like New. Like New. book.
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Librería: Brook Bookstore On Demand, Napoli, ItaliaBrook Bookstore On Demand
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EUR 66,23
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Condición: new. Questo è un articolo print on demand.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 80,24
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 9 11, 2025. The 12 full papers pre…sented in this book together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research. 260 pp. Englisch.
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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EUR 113,48
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Condición: New. Print on Demand.
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Librería: moluna, Greven, Alemaniamoluna
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EUR 70,33
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.
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Librería: Biblios, frankfurt am main, AlemaniaBiblios
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EUR 113,77
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Condición: New. PRINT ON DEMAND.
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Librería: Brook Bookstore On Demand, Napoli, ItaliaBrook Bookstore On Demand
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EUR 126,26
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Condición: new. Questo è un articolo print on demand.
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Librería: buchversandmimpf2000, Emtmannsberg, Alemaniabuchversandmimpf2000
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EUR 80,24
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book constitutes the proceedings of the 21st International Symposium on Applied Reconfigurable Computing. Architectures, Tools, and Applications, ARC 2025, held in Seville, Spain, during April 911, 2025.The 12 full papers presented… in this book together with 1 short paper from the technical program were carefully reviewed and selected from 40 submissions.ARC 2025 covers a wide range of topics, including hardware acceleration, security and fault tolerance, energy-efficient architectures, and emerging applications in artificial intelligence and high-performance computing. The symposium fostered collaboration and pushed the boundaries of state-of-the-art research.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 260 pp. Englisch.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 160,49
Envío por EUR 23,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting…factor for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology. 328 pp. Englisch.
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Librería: preigu, Osnabrück, Alemaniapreigu
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EUR 141,20
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Buch. Condición: Neu. A Priori Wire Length Estimates for Digital Design | Dirk Stroobandt | Buch | xxii | Englisch | 2001 | Springer US | EAN 9780792373605 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Librería: buchversandmimpf2000, Emtmannsberg, Alemaniabuchversandmimpf2000
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EUR 160,49
Envío por EUR 60,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The roots of this book, and of the new research field that it defines, lie in the scaling of VLSI technology. With gigahertz system clocks and ever accelerating design and process innovations, interconnects have become the limiting fact…or for both performance and density. This increasing impact of interconnects on the system implementation space necessitates new tools and analytic techniques to support the system designer. With respect to modeling and analysis, the response to interconnect dom inance is evolutionary. Atomistic- and grain-level models of interconnect structure, and performance models at multi-gigahertz operating frequencies, together guide the selection of improved materials and process technologies (e. g. , damascene copper wires, low-permittivity dielectrics). Previously in significant effects (e. g. , mutual inductance) are added into performance mod els, as older approximations (e. g. , lumped-capacitance gate load models) are discarded. However, at the system-level and chip planning level, the necessary response to interconnect dominance is revolutionary. Convergent design flows do not require only distributed RLC line models, repeater awareness, unifi cations with extraction and analysis, etc. Rather, issues such as wiring layer assignment, and early prediction of the resource and performance envelope for the system interconnect (in particular, based on statistical models of the system interconnect structure), also become critical. Indeed, system-level interconnect prediction has emerged as the enabler of improved interconnect modeling, more cost-effective system architectures, and more productive design technology.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 328 pp. Englisch.
