Olivares nuria (26 resultados)

Paperback. Condición: Brand New. 112 pages. Spanish language. 7.00x5.00x0.28 inches. In Stock. Sarkar, Anjan (ilustrador).

Paperback. Condición: Brand New. 94 pages. Spanish language. 7.00x5.00x0.25 inches. In Stock. Sarkar, Anjan (ilustrador).

Condición: New.

Condición: As New. Unread book in perfect condition.

Paperback. Condición: Brand New. 112 pages. Spanish language. 7.00x5.00x0.28 inches. In Stock. Sarkar, Anjan (ilustrador).

Condición: Fair. : Libro de texto de Ciencias Sociales para 5º de Primaria de la serie Savia, adaptado al currículo de Madrid. Este libro promueve la reflexión y el aprendizaje visual a través de la contextualización de los contenidos. Incluye un anexo de cartografía e ilustración titulado 'ATLAS. MI MUNDO, MI PAÍS' para facilitar la comprensión de los contenidos y el trabajo de los procedimientos de las Ciencias Sociales. EAN: 9788467574319 Tipo: Libros Categoría: Educación Título: Ciencias sociales. 5 Primaria. Savia. Madrid Autor: Alberto Navarro Elbal| Alfredo de la Mata Carrasco| Sara Martín Heredia| Ezequiel Parra Benito| Sergio López Barrancos Editorial: Grupo SM Educación Idioma: es-ES Páginas: 144 Formato: tapa blanda. Undabeytia Loizaga, Ramiro; Gabán Bravo, Jesús; Diáz Pérez Pelorroto, Alberto; GlezBros,; Andrada Guerrero, Javier; Nigot Giaux, Marie; Pérez González [Luis Doyague], Luis Miguel; Díaz Pérez, Alberto; Salas Loizaga, Ricardo; Galán Liquete, Jorge; Canals Arcediano, Mercè; Pérez De Muti, Marcelo; Arumí Casanovas, David; Fernández Del Castillo, Carlos; Sánchez Marcos, Lydia; Santolaya Ruiz Clavijo, Antonia; Aznar Medina, María Ángeles; Moreno Arrastio, Félix; DaGusto,; Muñoz Patiño, Ana María; Aguilar Ruiz, Mayra; Núñez Sagredo, Álvaro; Olivares Conde, Javier; Mark, Alya; Aragüez, Antonio; Pieruz Quintana, Alberto; Navarro García, José Luis; López Salán, Felipe; Montañá Ros, Marta; González Cardona, Armand; Serrano Sanjosé, Agustí; Julve Gil, Òscar; Gómez, Ariel Alejandro; , Puño; Avi,; Hernández Pintor, Nuria; , Arianeta; Fernández Román, Chema; La Perla, Artur; Blasco Feliu, Amadeu; Artimagos, Estudio (ilustrador). …

Condición: Very Good. : Libro de texto de Ciencias Sociales para 5º de Primaria de la serie Savia, adaptado al currículo de Madrid. Este libro promueve la reflexión y el aprendizaje visual a través de la contextualización de los contenidos. Incluye un anexo de cartografía e ilustración titulado 'ATLAS. MI MUNDO, MI PAÍS' para facilitar la comprensión de los contenidos y el trabajo de los procedimientos de las Ciencias Sociales. EAN: 9788467574319 Tipo: Libros Categoría: Educación Título: Ciencias sociales. 5 Primaria. Savia. Madrid Autor: Alberto Navarro Elbal| Alfredo de la Mata Carrasco| Sara Martín Heredia| Ezequiel Parra Benito| Sergio López Barrancos Editorial: Grupo SM Educación Idioma: es-ES Páginas: 144 Formato: tapa blanda. Undabeytia Loizaga, Ramiro; Gabán Bravo, Jesús; Diáz Pérez Pelorroto, Alberto; GlezBros,; Andrada Guerrero, Javier; Nigot Giaux, Marie; Pérez González [Luis Doyague], Luis Miguel; Díaz Pérez, Alberto; Salas Loizaga, Ricardo; Galán Liquete, Jorge; Canals Arcediano, Mercè; Pérez De Muti, Marcelo; Arumí Casanovas, David; Fernández Del Castillo, Carlos; Sánchez Marcos, Lydia; Santolaya Ruiz Clavijo, Antonia; Aznar Medina, María Ángeles; Moreno Arrastio, Félix; DaGusto,; Muñoz Patiño, Ana María; Aguilar Ruiz, Mayra; Núñez Sagredo, Álvaro; Olivares Conde, Javier; Mark, Alya; Aragüez, Antonio; Pieruz Quintana, Alberto; Navarro García, José Luis; López Salán, Felipe; Montañá Ros, Marta; González Cardona, Armand; Serrano Sanjosé, Agustí; Julve Gil, Òscar; Gómez, Ariel Alejandro; , Puño; Avi,; Hernández Pintor, Nuria; , Arianeta; Fernández Román, Chema; La Perla, Artur; Blasco Feliu, Amadeu; Artimagos, Estudio (ilustrador).…

Condición: New. Idioma/Language: Inglés. The Fieldbook for 'Ecosystems: Keeping the Balance' guides the pupils through the content combining different types of activities to encourage them to investigate and think through scientific models. The Fieldbook Pack includes an access to the online activities. *** Nota: Los envíos a España peninsular, Baleares y Canarias se realizan a través de mensajería urgente. No aceptamos pedidos con destino a Ceuta y Melilla.…

Condición: As New. : Este libro es un abecedario ilustrado para niños, ideal para aprender las letras de una manera divertida y creativa. Cada página doble presenta una letra, una palabra que comienza con esa letra y un pequeño texto literario. Cuenta con la participación de 27 ilustradores que aportan su talento para crear un abecedario único y especial. EAN: 9788448941291 Tipo: Libros Categoría: Infantil y Juvenil Título: Abecedari Il·lustrat Autor: Carles Cano Editorial: Editorial Barcanova Idioma: ca Páginas: 72 Formato: tapa dura. Serra, Adolfo; Rivas, Víctor; Díez, Miguel Ángel; Solé Vendrell, Carme; Julve, Òscar; Maier Pan, Ximena; Díaz, Nuria; Espluga, Maria; Serrano, Lucia; Olivares, Javier; Barrenetxea, Iban; Pintor, David; Delicado, Federico; Valverde, Mikel; González, Emilio; Santolaya, Antonia; López, Xan; Giménez, Paco; Prado, Anxo; Gamón, Alberto; Urberuaga, Emilio (ilustrador).…

BPM. Condición: New. New Book. Shipped from UK. Established seller since 2000.

Paperback. Condición: new. Paperback. Eclecticism, accumulation, superimposition, relations, celebrationthese are just some of the words that can be used to describe this publication, Jordi Colomer. Which looks at the artistic universe and life of Jordi Colomer, some of sculptures, collages, photographs, installations, videos and live actions; from the late 1980s to today. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. …

Condición: New.

Condición: New.

Hardcover. Condición: Brand New. 424 pages. 8.66x6.69x0.94 inches. In Stock.

Condición: New.

Paperback. Condición: new. Paperback. Transistor scaling no longer carries a computing system on its own. The gains that matter now come from how dies are partitioned, connected, stacked, powered, and cooled inside one package - and that has turned advanced packaging into a design discipline in its own right. This is the working textbook for that discipline. It opens by deriving the economics that govern every decision - defect density, die cost versus area, composite yield, the assembly-yield penalty, and the point at which splitting a design stops paying - then builds on those numbers through twenty-two rigorously quantitative chapters. You will learn die-to-die links and the UCIe stack through revision 3.0; silicon, organic, and glass-core substrates; embedded bridges and through-silicon vias; copper-to-copper hybrid bonding down to sub-micron pitch; three-dimensional stacking and high-bandwidth memory through HBM4; kilowatt-class power delivery; cooling from interface materials to direct-to-silicon microfluidics; and co-packaged optics.Unlike reference handbooks, this book teaches. Every chapter carries learning objectives, full derivations with tracked units, worked examples solved with real numbers, and practice problems with complete solutions. More than 150 original figures render every cross-section, scaling law, and tradeoff from first principles. Appendices supply a symbol list, glossary, a standards reference with revision years, materials property tables, and a complete cost-and-yield model. Written for upper-undergraduate and graduate students and for the packaging, integration, and system engineers building multi-die products.What's insideThe economics of disaggregation - yield models, gross-die-per-wafer, known-good-die, and the cost break-even that decides whether to split a chipDie-to-die interconnect from first principles (energy per bit, bandwidth density, beachfront) plus UCIe 3.0, Bunch of Wires, and OpenHBIThe full substrate menu: silicon, organic, and RDL interposers; embedded bridges with TSVs; panel-level and glass-core substratesMicrobump scaling to its assembly-yield wall, then copper-to-copper hybrid bonding from process integration to sub-micron pitchThree-dimensional stacking with active base dies, and high-bandwidth memory through HBM4 with custom base diesPower delivery for kilowatt-class packages and thermal design from TIMs to embedded microfluidic coolingCo-packaged optics, the multi-die design flow, test and known-good-die, thermomechanical reliability, signal/power integrity, and supply-chain trustWhy this bookTeaches instead of cataloging: derivations, worked examples, and fully solved problem sets in every chapterCurrent to the technologies shipping today - UCIe 3.0, HBM4, backside power delivery, hybrid bonding, co-packaged opticsQuantitative throughout: pitches in micrometers, energy in femtojoules per bit, bandwidth density in GB/s/mm, thermal resistance in K/W150-plus original, self-contained figures - every cross-section and scaling law drawn from the underlying physicsA complete, reusable cost-and-yield model you can re-run for your own productA standards reference with current revision years, so the numbers stay usableWho it's forUpper-undergraduate and graduate students in electrical, computer, and materials engineeringPackaging, assembly, and heterogeneous-integration engineers moving from monolithic SoCs to multi-die productsChip architects and SoC designers now reasoning about partitioning, interposers, and thermal budgetsSignal/power-integrity, reliability, and test engineers supporting 2.5D and 3D programsInstructors building a modern advanced-packaging or heterogeneous-integration course<l Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Taschenbuch. Condición: Neu. Neuware - Eclecticism, accumulation, superimposition, relations, celebrationà these are just some of the words that can be used to describe this publication, Jordi Colomer. Façana Foto Festa Futur Fideus (Jordi Colomer. Facade Photo Fiesta Future Noodles), which looks at the artistic universe and life of Jordi Colomer (Barcelona, 1962), epitomised in sixty or so works û sculptures, collages, photographs, installations, videos and live actions û from the late 1980s to the present day. The book includes a selection of articles and essays by Elvira Dyangani Ose, Martí Peran, Benedetta Casini, Ignasi Duarte, Carolina Olivares and Núria Gómez Gabriel that shed light on various aspects of ColomerÆs practice, as well as extensive graphic documentation about his work. The overall intention is to set the chronological order of the narrative in disarray and to blend the accounts that help us to understand the artistÆs universe. This book is published in three separate editions in Catalan, English and Spanish.…

Paperback. Condición: new. Paperback. Eclecticism, accumulation, superimposition, relations, celebrationthese are just some of the words that can be used to describe this publication, Jordi Colomer. Which looks at the artistic universe and life of Jordi Colomer, some of sculptures, collages, photographs, installations, videos and live actions; from the late 1980s to today. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. …

Paperback. Condición: new. Paperback. Transistor scaling no longer carries a computing system on its own. The gains that matter now come from how dies are partitioned, connected, stacked, powered, and cooled inside one package - and that has turned advanced packaging into a design discipline in its own right. This is the working textbook for that discipline. It opens by deriving the economics that govern every decision - defect density, die cost versus area, composite yield, the assembly-yield penalty, and the point at which splitting a design stops paying - then builds on those numbers through twenty-two rigorously quantitative chapters. You will learn die-to-die links and the UCIe stack through revision 3.0; silicon, organic, and glass-core substrates; embedded bridges and through-silicon vias; copper-to-copper hybrid bonding down to sub-micron pitch; three-dimensional stacking and high-bandwidth memory through HBM4; kilowatt-class power delivery; cooling from interface materials to direct-to-silicon microfluidics; and co-packaged optics.Unlike reference handbooks, this book teaches. Every chapter carries learning objectives, full derivations with tracked units, worked examples solved with real numbers, and practice problems with complete solutions. More than 150 original figures render every cross-section, scaling law, and tradeoff from first principles. Appendices supply a symbol list, glossary, a standards reference with revision years, materials property tables, and a complete cost-and-yield model. Written for upper-undergraduate and graduate students and for the packaging, integration, and system engineers building multi-die products.What's insideThe economics of disaggregation - yield models, gross-die-per-wafer, known-good-die, and the cost break-even that decides whether to split a chipDie-to-die interconnect from first principles (energy per bit, bandwidth density, beachfront) plus UCIe 3.0, Bunch of Wires, and OpenHBIThe full substrate menu: silicon, organic, and RDL interposers; embedded bridges with TSVs; panel-level and glass-core substratesMicrobump scaling to its assembly-yield wall, then copper-to-copper hybrid bonding from process integration to sub-micron pitchThree-dimensional stacking with active base dies, and high-bandwidth memory through HBM4 with custom base diesPower delivery for kilowatt-class packages and thermal design from TIMs to embedded microfluidic coolingCo-packaged optics, the multi-die design flow, test and known-good-die, thermomechanical reliability, signal/power integrity, and supply-chain trustWhy this bookTeaches instead of cataloging: derivations, worked examples, and fully solved problem sets in every chapterCurrent to the technologies shipping today - UCIe 3.0, HBM4, backside power delivery, hybrid bonding, co-packaged opticsQuantitative throughout: pitches in micrometers, energy in femtojoules per bit, bandwidth density in GB/s/mm, thermal resistance in K/W150-plus original, self-contained figures - every cross-section and scaling law drawn from the underlying physicsA complete, reusable cost-and-yield model you can re-run for your own productA standards reference with current revision years, so the numbers stay usableWho it's forUpper-undergraduate and graduate students in electrical, computer, and materials engineeringPackaging, assembly, and heterogeneous-integration engineers moving from monolithic SoCs to multi-die productsChip architects and SoC designers now reasoning about partitioning, interposers, and thermal budgetsSignal/power-integrity, reliability, and test engineers supporting 2.5D and 3D programsInstructors building a modern advanced-packaging or heterogeneous-integration Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Taschenbuch. Condición: Neu. Neuware.

Condición: Good. Usado. Undabeytia Loizaga, Ramiro; Gabán Bravo, Jesús; Diáz Pérez Pelorroto, Alberto; GlezBros,; Andrada Guerrero, Javier; Nigot Giaux, Marie; Pérez González [Luis Doyague], Luis Miguel; Díaz Pérez, Alberto; Salas Loizaga, Ricardo; Galán Liquete, Jorge; Canals Arcediano, Mercè; Pérez De Muti, Marcelo; Arumí Casanovas, David; Fernández Del Castillo, Carlos; Sánchez Marcos, Lydia; Santolaya Ruiz Clavijo, Antonia; Aznar Medina, María Ángeles; Moreno Arrastio, Félix; DaGusto,; Muñoz Patiño, Ana María; Aguilar Ruiz, Mayra; Núñez Sagredo, Álvaro; Olivares Conde, Javier; Mark, Alya; Aragüez, Antonio; Pieruz Quintana, Alberto; Navarro García, José Luis; López Salán, Felipe; Montañá Ros, Marta; González Cardona, Armand; Serrano Sanjosé, Agustí; Julve Gil, Òscar; Gómez, Ariel Alejandro; , Puño; Avi,; Hernández Pintor, Nuria; , Arianeta; Fernández Román, Chema; La Perla, Artur; Blasco Feliu, Amadeu; Artimagos, Estudio (ilustrador). …

Condición: New.

Condición: Bien. Gracias, su compra ayuda a financiar programas para combatir el analfabetismo. Serra, Adolfo; Rivas, Víctor; Díez, Miguel Ángel; Solé Vendrell, Carme; Julve, Òscar; Maier Pan, Ximena; Díaz, Nuria; Espluga, Maria; Serrano, Lucia; Olivares, Javier; Barrenetxea, Iban; Pintor, David; Delicado, Federico; Valverde, Mikel; González, Emilio; Santolaya, Antonia; López, Xan; Giménez, Paco; Prado, Anxo; Gamón, Alberto; Urberuaga, Emilio (ilustrador). …

Condición: New. Print on Demand.

PAP. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

PAP. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.