Moiseev konstantin (28 resultados)

Hardcover. Condición: New. BRAND NEW hardcover. Book.

Condición: New.

Paperback. Condición: New.

Condición: New.

Condición: New. In English.

Condición: New. In English.

Paperback. Condición: Brand New. reprint edition. 249 pages. 9.30x6.20x0.60 inches. In Stock.

Condición: New. pp. 300.

Taschenbuch. Condición: Neu. Multi-Net Optimization of VLSI Interconnect | Konstantin Moiseev (u. a.) | Taschenbuch | xvi | Englisch | 2016 | Springer | EAN 9781493942626 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Hardcover. Condición: Brand New. 233 pages. 9.25x6.25x0.75 inches. In Stock.

Condición: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.…

Condición: New. pp. 233.

Condición: As New. Unread book in perfect condition.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: As New. Unread book in perfect condition.

Hardcover. Condición: Good. In Russian. Moiseev, Konstantin Alekseevich. Oilseed Rare. Leningrad: Kolos. Leningrad detachment, 1976. All images are for identification of editions only. Several books of the same edition may be available. Please feel free to request photos of available books.SKU7026943.…

Condición: new. Questo è un articolo print on demand.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits. 252 pp. Englisch.…

Condición: new. Questo è un articolo print on demand.

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits. 252 pp. Englisch.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimizationPresents research results that provide a level of design optimization which does not exist in comm.…

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimizationPresents research results that provide a level of design optimization which does not exist in comm.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 252 pp. Englisch.…

Condición: New. PRINT ON DEMAND pp. 300.

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 252 pp. Englisch.…

Condición: New. Print on Demand pp. 233.

Condición: New. PRINT ON DEMAND pp. 233.