Mayappan ramani (10 resultados)

Taschenbuch. Condición: Neu. Interaction of Sn-9Zn and Sn-8Zn-3Bi lead-free on copper metallization | Wetting, joint strength and intermetallic | Ramani Mayappan | Taschenbuch | Englisch | 2010 | LAP LAMBERT Academic Publishing | EAN 9783838384528 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for green products , a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties of Sn-3.5Ag-1.0Cu-xZn reacting with copper substrate. The percentage of zinc varies between 0% and 0.7%. The solders and copper substrate were let to react at different soldering time and temperature. Some information are given on the wetting behavior, the interfacial reaction morphology and intermetallic thickness as the soldering condition varies. The wetting reaction between the solders and copper substrate is due to the interaction between Sn and Cu atoms. This interaction leads to the formation of scallop Cu6Sn5 intermetallic. It was concluded that the growth of the intermetallic follows 76 pp. Englisch.…

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for green products , a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties of Sn-3.5Ag-1.0Cu-xZn reacting with copper substrate. The percentage of zinc varies between 0% and 0.7%. The solders and copper substrate were let to react at different soldering time and temperature. Some information are given on the wetting behavior, the interfacial reaction morphology and intermetallic thickness as the soldering condition varies. The wetting reaction between the solders and copper substrate is due to the interaction between Sn and Cu atoms. This interaction leads to the formation of scallop Cu6Sn5 intermetallic. It was concluded that the growth of the intermetallic follows.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mayappan RamaniRamani Mayappan is a Senior Lecturer in Faculty of Applied Science, Universiti Teknologi Mara Perlis, Malaysia. Ramani s research area includes metal-metal interaction with a specific interest in solder-substrate react.…

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable Pb-free solders an important issue for microelectronics assembly. This book describes some properties of Sn-9Zn and Sn-8Zn-3Bi lead-free solders interacting with copper substrate. Some information are given on the wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of the solders on Cu substrate. The wetting reaction between Sn-Zn solder and Cu substrate is due the interaction between Zn and Cu atoms. This interaction leads to the formation of a flat Cu5Zn8 and scallop CuZn intermediate phases. The book also explains the degradation of the solder joint strength due to Zn-depletion zone and Kirkendall voids. Finally, The evolution of the Cu5Zn8 intermetallic and the activation energy for the growth of the intermetallic under solid state aging is explained in depth. 192 pp. Englisch.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mayappan RamaniRamani Mayappan is a Senior Lecturer in Faculty of Applied Science, Universiti Teknologi Mara, Perlis Branch, Malaysia. Ramani s research area includes metal-metal interaction with a specific interest in solder-sub.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Practically all microelectronics assemblies in use utilize Sn-Pb eutectic solder for interconnections. Owing to worldwide environmental legislation to ban toxic materials in solder and demands for 'green products', a variety of lead-free solders have been developed. Sn-Ag-Cu solder is one of the most suitable candidates to replace lead solders. However, the performance of Sn-Ag-Cu alloys is not considered good enough to meet all needs to be for a solder material. To improve the solder material properties, a fourth element, Zn, is added into the solder alloy. This book describes some properties of Sn-3.5Ag-1.0Cu-xZn reacting with copper substrate. The percentage of zinc varies between 0% and 0.7%. The solders and copper substrate were let to react at different soldering time and temperature. Some information are given on the wetting behavior, the interfacial reaction morphology and intermetallic thickness as the soldering condition varies. The wetting reaction between the solders and copper substrate is due to the interaction between Sn and Cu atoms. This interaction leads to the formation of scallop Cu6Sn5 intermetallic. It was concluded that the growth of the intermetallic followsVDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 76 pp. Englisch.…

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable Pb-free solders an important issue for microelectronics assembly. This book describes some properties of Sn-9Zn and Sn-8Zn-3Bi lead-free solders interacting with copper substrate. Some information are given on the wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of the solders on Cu substrate. The wetting reaction between Sn-Zn solder and Cu substrate is due the interaction between Zn and Cu atoms. This interaction leads to the formation of a flat Cu5Zn8 and scallop CuZn intermediate phases. The book also explains the degradation of the solder joint strength due to Zn-depletion zone and Kirkendall voids. Finally, The evolution of the Cu5Zn8 intermetallic and the activation energy for the growth of the intermetallic under solid state aging is explained in depth.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Emerging environmental regulations worldwide have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has made the search for suitable Pb-free solders an important issue for microelectronics assembly. This book describes some properties of Sn-9Zn and Sn-8Zn-3Bi lead-free solders interacting with copper substrate. Some information are given on the wetting behavior, the interfacial reaction, mechanical properties and growth kinetics of the solders on Cu substrate. The wetting reaction between Sn-Zn solder and Cu substrate is due the interaction between Zn and Cu atoms. This interaction leads to the formation of a flat Cu5Zn8 and scallop CuZn intermediate phases. The book also explains the degradation of the solder joint strength due to Zn-depletion zone and Kirkendall voids. Finally, The evolution of the Cu5Zn8 intermetallic and the activation energy for the growth of the intermetallic under solid state aging is explained in depth.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 192 pp. Englisch.…