Liu duixian (39 resultados)

Condición: new.

Condición: New.

Condición: New.

Condición: As New. Unread book in perfect condition.

HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

Condición: New.

Condición: New.

Condición: As New. Unread book in perfect condition.

Condición: New.

Hardcover. Condición: New. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Condición: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Hardback. Condición: New. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.  The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: . Includes a brief history of antenna-in-package technology  . Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)  . Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.…

Condición: New. In English.

HRD. Condición: New. New Book. Shipped from UK. Established seller since 2000.

Condición: New.

Condición: new.

Condición: New.

Condición: New. 2020. 1st Edition. Hardcover. . . . . .

Condición: New. In English.

Hardcover. Condición: Brand New. 300 pages. 9.25x6.25x1.25 inches. In Stock.

Condición: New. This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Editor(s): Liu, Duixian; Pfeiffer, Ulrich; Grzyb, Janusz; Gaucher, Brian. Num Pages: 850 pages, Illustrations. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 249 x 172 x 52. Weight in Grams: 1548. . 2009. 1st Edition. Hardcover. . . . .…

Condición: New. pp. 850.

Condición: New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.

Condición: New.

Condición: New. This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna de.

Hardback. Condición: New. A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP.  The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: . Includes a brief history of antenna-in-package technology  . Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN)  . Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.…

Condición: New. pp. 850.

Condición: New. This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Editor(s): Liu, Duixian; Pfeiffer, Ulrich; Grzyb, Janusz; Gaucher, Brian. Num Pages: 850 pages, Illustrations. BIC Classification: TJK. Category: (P) Professional & Vocational. Dimension: 249 x 172 x 52. Weight in Grams: 1548. . 2009. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Buch. Condición: Neu. Neuware - This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging.\* Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna\* One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging\* Contains a good number of case studies to aid understanding\* Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging. …

Hardcover. Condición: Brand New. 1st edition. 850 pages. 9.84x6.85x1.97 inches. In Stock.