Liangxing hu (8 resultados)

- Tapa dura
Librería: BargainBookStores, Grand Rapids, MI, Estados Unidos de AmericaBargainBookStores
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 57,19
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 5 disponibles
Hardback or Cased Book. Condición: New. CMOS-MEMS Fabrication Technologies and Devices. Book.

- Tapa dura
Librería: California Books, Miami, FL, Estados Unidos de AmericaCalifornia Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 62,77
Envío por EUR 2,69Se envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New.

- Tapa dura
- Impresión bajo demanda
Librería: PBShop.store US, Wood Dale, IL, Estados Unidos de AmericaPBShop.store US
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 58,76
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
HRD. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

- Tapa dura
- Impresión bajo demanda
Librería: PBShop.store UK, Fairford, GLOS, Reino UnidoPBShop.store UK
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 54,95
Envío por EUR 6,02Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
HRD. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

- Tapa dura
- Impresión bajo demanda
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de AmericaGrand Eagle Retail
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 64,31
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponible
Hardcover. Condición: new. Hardcover. This Reprint collects 10 outstanding peer-reviewed articles, focusing on CMOS-MEMS fabrication technologies and devices. The content of these articles is within the scope of a Special Issue. Within the articles, CMOS gas sensors are assessed for gas mixture analysis; CMOS-MEMS pixel sensors are used for thermal neutron imaging; resistive microbolometers are fabricated via the CMOS process; an MEMS Pirani sensor is utilized for in situ pressure distribution sensing; CMOS low-noise amplifiers, power amplifiers, and energy micro-harvesters are manufactured using CMOS-MEMS technology; and high aspect ratio TSVs are used for 3D integration. This Reprint is especially relevant for any readers with an interest in the abovementioned topics. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

- Tapa dura
- Impresión bajo demanda
Librería: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 65,20
Envío por EUR 33,16Se envía de Australia a Estados Unidos de AmericaCantidad disponible: 1 disponible
Hardcover. Condición: new. Hardcover. This Reprint collects 10 outstanding peer-reviewed articles, focusing on CMOS-MEMS fabrication technologies and devices. The content of these articles is within the scope of a Special Issue. Within the articles, CMOS gas sensors are assessed for gas mixture analysis; CMOS-MEMS pixel sensors are used for thermal neutron imaging; resistive microbolometers are fabricated via the CMOS process; an MEMS Pirani sensor is utilized for in situ pressure distribution sensing; CMOS low-noise amplifiers, power amplifiers, and energy micro-harvesters are manufactured using CMOS-MEMS technology; and high aspect ratio TSVs are used for 3D integration. This Reprint is especially relevant for any readers with an interest in the abovementioned topics. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

- Tapa dura
- Impresión bajo demanda
Librería: CitiRetail, Stevenage, Reino UnidoCitiRetail
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 63,02
Envío por EUR 44,40Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponible
Hardcover. Condición: new. Hardcover. This Reprint collects 10 outstanding peer-reviewed articles, focusing on CMOS-MEMS fabrication technologies and devices. The content of these articles is within the scope of a Special Issue. Within the articles, CMOS gas sensors are assessed for gas mixture analysis; CMOS-MEMS pixel sensors are used for thermal neutron imaging; resistive microbolometers are fabricated via the CMOS process; an MEMS Pirani sensor is utilized for in situ pressure distribution sensing; CMOS low-noise amplifiers, power amplifiers, and energy micro-harvesters are manufactured using CMOS-MEMS technology; and high aspect ratio TSVs are used for 3D integration. This Reprint is especially relevant for any readers with an interest in the abovementioned topics. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

- Tapa dura
- Impresión bajo demanda
Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 82,79
Envío por EUR 35,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Buch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This Reprint collects 10 outstanding peer-reviewed articles, focusing on CMOS-MEMS fabrication technologies and devices. The content of these articles is within the scope of a Special Issue. Within the articles, CMOS gas sensors are assessed for gas mixture analysis; CMOS-MEMS pixel sensors are used for thermal neutron imaging; resistive microbolometers are fabricated via the CMOS process; an MEMS Pirani sensor is utilized for in situ pressure distribution sensing; CMOS low-noise amplifiers, power amplifiers, and energy micro-harvesters are manufactured using CMOS-MEMS technology; and high aspect ratio TSVs are used for 3D integration. This Reprint is especially relevant for any readers with an interest in the abovementioned topics. …