Lee tae kyu (25 resultados)

Hard Cover. Condición: Very Good-. Estado de la sobrecubierta: Issued Without Dust Jacket. Text is in Korean and English. Bottom corners bumped; binding has other edgewear; pages have small bottom-corner crease; tight, text clean. 231 p., illustrated [u tgr alo otob:40] Size: Oversize.

Condición: New.

Condición: New.

Condición: New.

Condición: New. In English.

Condición: New. pp. 253.

Condición: New. pp. x + 200.

Taschenbuch. Condición: Neu. Fundamentals of Lead-Free Solder Interconnect Technology | From Microstructures to Reliability | Tae-Kyu Lee (u. a.) | Taschenbuch | xiii | Englisch | 2016 | Springer | EAN 9781489978011 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Hardcover. Condición: Brand New. 253 pages. 9.25x6.25x0.75 inches. In Stock.

Paperback. Condición: Brand New. reprint edition. 253 pages. 9.00x6.00x0.75 inches. In Stock.

Condición: Sehr gut. Zustand: Sehr gut | Seiten: 268 | Sprache: Englisch | Produktart: Bücher | This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.…

Condición: As New. Unread book in perfect condition.

Condición: As New. Unread book in perfect condition.

Condición: new. Questo è un articolo print on demand.

Condición: new. Questo è un articolo print on demand.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research. 268 pp. Englisch.…

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research. 268 pp. Englisch.…

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides an up-to-date overview on lead-free soldering technologiesCovers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniquesExplores emerging technologies in lead-free solderingT.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides an up-to-date overview on lead-free soldering technologiesCovers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering techniquesExplores emerging technologies in lead-free solderingT.…

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 268 pp. Englisch.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 268 pp. Englisch.…

Condición: New. Print on Demand pp. 253.

Condición: New. Print on Demand pp. x + 200 148 Illus. (80 Col.).

Condición: New. PRINT ON DEMAND pp. 253.

Condición: New. PRINT ON DEMAND pp. x + 200.