Lasance c j m (46 resultados)

Condición: New.

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Condición: As New. Unread book in perfect condition.

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Condición: New. pp. xi + 335.

Condición: New. pp. xi + 361.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the 'lower' end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.…

Paperback. Condición: Brand New. 335 pages. 9.45x6.30x0.80 inches. In Stock.

Paperback. Condición: Brand New. 361 pages. 9.45x6.30x0.85 inches. In Stock.

Condición: New. In English.

Condición: New. In English.

Taschenbuch. Condición: Neu. Thermal Management of Electronic Systems II | Proceedings of EUROTHERM Seminar 45, 20-22 September 1995, Leuven, Belgium | E. Beyne (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401063180 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condición: Neu. Thermal Management of Electronic Systems | Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands | C. J. Hoogendoorn (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401044721 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterisation of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure. Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems.…

Gebunden. Condición: New. The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytica.

Gebunden. Condición: New. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermall.

Hardcover. Condición: Brand New. 1st edition. 348 pages. 10.00x6.75x1.00 inches. In Stock.

Hardcover. Condición: Brand New. 361 pages. 10.00x6.75x0.75 inches. In Stock.

Hardcover. Condición: new. Hardcover. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. This text is suitable for research and development engineers and scientists whose work involves the design and manufacture of electronic systems. This volume presents an overview of recent developments in the thermal management of electronic systems. The topics covered include thermal management in general, thermally induced failure, channels and electronic components, measurement techniques, liquid cooling and thermal characterization. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Hardcover. Condición: new. Hardcover. The volume presents an overview of current developments in the thermal management of electronic systems. This has been seen as an increasingly important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterization of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure. Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems. The volume presents an overview of current developments in the thermal management of electronic systems. Topics covered include: thermal management in general, analytical and computational thermal modelling, and thermal characterization of components. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.…