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Thermal Management of Electronic Systems: Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands: v. 1 - Tapa dura
Sinopsis
Preface. 1: Invited Lectures; C.J.M. Lasance, A. Bar-Cohen, S. Witzman. 2: Numerical and Experimental Analysis of Systems; S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield, J.D. Parry, D.G. Tatchell, H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman, W. Nelemans, E. Lauwers, J.L. Blanchard, J.M. Morelle, M. Misale. 3: Numerical and Experimental Analysis of Channels; C. di Perna, A. Evangelisti, M. Paroncini, R. Ricci, J.B. Saulnier, H.Y. Wang, B. Fourka, O. Manca, S. Nardini, V. Naso. 4: Numerical and Experimental Analysis of Electronic Parts; N. Ottavy, M. Bourhrara, J.-P. Le Jannou, P. Paris, G. Wachutka, J. Funk, H. Baltes, S. Mergui, F. Penot, J. Punch, M. Davies, J. Aklhoja, D. Rauly, F. Grandjean, K. Nederveen. 5: Measurement Techniques; R.P. Tye, R.L. Gardner, H.J.L. Vanlaer, C.J.M. Lasance, P. Rodgers, M. Davies. 6: Liquid Cooling of Electronic Devices; B. Gromoll, K. Köberle, H. Auracher, G. Guglielmini, M. Misale, C. Schenone. 7: Thermal Characterization of Electronic Parts; T. Fromont, B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne, E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens, M. Davies, J. Lohan, J. Punch, T. Moore, D. Liu, J. Barrett, S.C.Ó. Mathúna. 8: Thermal Stress and Die Attach Defects; S. Witzman, D.E. Mix, A. Bar-Cohen, F. Michard, J.M. Dupont, H. Ribot, M. Salagoity. Author Index.
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Reseña del editor
This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.
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Thermal Management of Electronic Systems: Proceedings of EUROTHERM Seminar 29, 14?16 June 1993, Delft, The Netherlands
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Thermal Management of Electronic Systems: v. 1: Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands
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Gebunden. Condición: New. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermall. Nº de ref. del artículo: 898696179
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Thermal Management of Electronic Systems (Hardcover)
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Hardcover. Condición: new. Hardcover. This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. This text is suitable for research and development engineers and scientists whose work involves the design and manufacture of electronic systems. This volume presents an overview of recent developments in the thermal management of electronic systems. The topics covered include thermal management in general, thermally induced failure, channels and electronic components, measurement techniques, liquid cooling and thermal characterization. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. Nº de ref. del artículo: 9780792328018
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems. Nº de ref. del artículo: 9780792328018
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems. 352 pp. Englisch. Nº de ref. del artículo: 9780792328018
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