Kv subramanian (45 resultados)

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Paperback. Condición: New.

Condición: New. pp. 214.

Condición: New. pp. 214.

Condición: New.

Paperback. Condición: Brand New. 214 pages. 9.96x7.01x0.47 inches. In Stock.

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Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Paperback. Condición: New.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: Gut. Zustand: Gut | Seiten: 384 | Sprache: Englisch | Produktart: Bücher | "This book contains the papers that were invited for a special issue of Journal of Materials Science: Materials in Electronics.to provide wider awareness of the current status of lead-free electronic solders."--Preface.…

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: New.

Condición: New.

Condición: New.

Condición: New.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so.The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications).This material originally appeared in a special issue of Journal of Materials Science: Materials in Electronics. Because this journal may not be a regular source of scientific information foracademic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles are being reprinted in book form.…

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, till recently, solders used in electronics, remained lead-based. The worldwide multi-facetted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in these many different sources, so it becomes essential to have most of the relevant and currently available information presented in a single publication. With this goal in mind the important issues encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so.The chapters are organized around the following subject areas: themodynamics and phase diagrams, solder developments, processing issues, mechanical property considerations, effects of thermal excursions (TMF), electromigraion, whisker growth, tin pest, and industrial perspectives (consumer electronics, and high-end high reliability applications).This material originally appeared in a special issue of Journal of Materials Science: Materials in Electronics. Because this journal may not be a regular source of scientific information foracademic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles are being reprinted in book form.…

Condición: New. pp. 384.

Hardcover. Condición: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Hardcover. Condición: Brand New. 1st edition. 375 pages. 10.00x7.00x1.00 inches. In Stock.

Condición: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.…

Condición: As New. Unread book in perfect condition.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.