Jennie hwang (48 resultados)

Condición: good. Signs of wear and consistent use.

Hardcover. Condición: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condición: Very Good. Sorry, No international shipping on this item.Ex-Library hardcover with dj in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.

Condición: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condición: Very Good. This book has been examined carefully and the cover and pages are in very good condition. It is clean and tight inside. Fast Shipping - Safe and Secure Mailer - Our goal is to deliver a better item than what you are hoping for! If not we will make it right.

Condición: very_good. Book is in very good condition and may include minimal underlining highlighting. The book can also include "From the library of" labels. May not contain miscellaneous items toys, dvds, etc. . We offer 100% money back guarantee and 24 7 customer service.

Hardcover. Condición: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Condición: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Paperback. Condición: Good. First Paperback Edition. minor shelf wear and cover soil, corners lightly bumped, former owners name inside front cover, xxii + 456 pages including appendix and index, covers chemical and physical characteristics, metallurgy, rheology of pastes, soldering methods and application techniques, cleaning, reliability and quality control, testing and related topics, bw illustrations Size: 6 x 9.…

Condición: New.

Paperback or Softback. Condición: New. Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly. Book.

Hardcover. Condición: Fine. Estado de la sobrecubierta: Fine. hardback book and dust jacket in fine condition.

Condición: As New. Unread book in perfect condition.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: New.

Condición: New. In English.

hardcover. iT'S NEW!!! Ships same or next b.

Condición: As New. Unread book in perfect condition.

Condición: New. pp. 484.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.…

Condición: Used. pp. xxxv + 473 1st Edition.

Condición: Used. pp. xxxv + 473 Illus.

Condición: Used. pp. xxxv + 473.

Taschenbuch. Condición: Neu. Solder Paste in Electronics Packaging | Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly | Jennie S. Hwang | Taschenbuch | xxiv | Englisch | 2012 | Springer | EAN 9789401160520 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condición: New.

Condición: New. Brand new book, sourced directly from publisher. Dispatch time is 7-8 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Condición: New. Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems. Num Pages: 480 pages, 77 black & white illustrations, biography. BIC Classification: TGP; THRS; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 24. Weight in Grams: 703. . 1992. New ed. Paperback. . . . .…

Condición: New.

Condición: New. pp. 484.