Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
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This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
"Sobre este título" puede pertenecer a otra edición de este libro.
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 272 pp. Englisch. Nº de ref. del artículo: 9781461372318
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa. Nº de ref. del artículo: 4195376
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 272 pp. Englisch. Nº de ref. del artículo: 9781461372318
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Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers. Nº de ref. del artículo: 9781461372318
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