Publicado por New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Idioma: Inglés
Librería: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Alemania
EUR 14,00
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Añadir al carritoXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 102,91
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Añadir al carritoCondición: New. In.
EUR 89,99
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 111,06
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EUR 99,44
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Añadir al carritoPaperback. Condición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 101,61
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Añadir al carritoCondición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 102,07
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Best Price, Torrance, CA, Estados Unidos de America
EUR 96,05
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EUR 100,39
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Añadir al carritoCondición: New.
Publicado por Springer New York, Springer New York, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 111,53
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Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 110,30
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Librería: Best Price, Torrance, CA, Estados Unidos de America
EUR 104,74
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EUR 122,82
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.
Publicado por Springer-Verlag Publishing, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: Salish Sea Books, Bellingham, WA, Estados Unidos de America
EUR 100,89
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Añadir al carritoCondición: Like New. Fine/As New; Semi-Flexible Covers; This book is brand new and still sealed in the publisher's original shrinkwrap; Perfect, new condition; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Red and purple covers with title in white lettering; 2013, Springer-Verlag Publishing; 265 pages; "Designing 2D and 3D Network-on-Chip Architectures," by Konstantinos Tatas, et al.
Publicado por Springer New York, Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 106,99
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Añadir al carritoBuch. Condición: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 131,47
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Publicado por Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 146,38
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Añadir al carritoCondición: New. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Num Pages: 278 pages, 65 black & white illustrations, 79 colour illustrations, 12 black & white tables, biograp. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 241 x 167 x 21. Weight in Grams: 556. . 2013. 2014th Edition. Hardcover. . . . .
Publicado por Springer New York, Springer New York Aug 2016, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Idioma: Inglés
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 119,99
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 280 pp. Englisch.
EUR 151,76
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Añadir al carritoHardcover. Condición: Brand New. 300 pages. 9.25x6.25x0.75 inches. In Stock.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 102,20
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EUR 163,56
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Añadir al carritoPaperback. Condición: Brand New. reprint edition. 278 pages. 9.25x6.10x0.66 inches. In Stock.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 111,27
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Publicado por Springer-Verlag New York Inc., 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de America
EUR 182,25
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Añadir al carritoCondición: New. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Num Pages: 278 pages, 65 black & white illustrations, 79 colour illustrations, 12 black & white tables, biograp. BIC Classification: TJFC; UYF. Category: (P) Professional & Vocational. Dimension: 241 x 167 x 21. Weight in Grams: 556. . 2013. 2014th Edition. Hardcover. . . . . Books ship from the US and Ireland.
Publicado por Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 127,26
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Añadir al carritoHardcover. Condición: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 185,67
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Añadir al carritoCondición: New. pp. 278.
Publicado por Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Idioma: Inglés
Librería: Grand Eagle Retail, Mason, OH, Estados Unidos de America
EUR 134,28
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Añadir al carritoPaperback. Condición: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Publicado por Springer-Verlag New York Inc., New York, 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 294,11
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Añadir al carritoPaperback. Condición: new. Paperback. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Publicado por Springer-Verlag New York Inc., New York, NY, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 311,86
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Añadir al carritoHardcover. Condición: new. Hardcover. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Publicado por Springer New York Okt 2013, 2013
ISBN 10: 1461442737 ISBN 13: 9781461442738
Idioma: Inglés
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 106,99
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Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliabilty. Case studies are used to illuminate new design methodologies. This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies. 280 pp. Englisch.
Publicado por Springer-Verlag New York Inc., 2016
ISBN 10: 1493945505 ISBN 13: 9781493945504
Idioma: Inglés
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
EUR 118,38
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Añadir al carritoPaperback / softback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 433.