9789811900822 - microsystem based on sip technology (12 resultados)
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Librería: StainesBook, Weybridge, SURRE, Reino UnidoStainesBook
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Condición: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.
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Librería: Buchpark, Trebbin, AlemaniaBuchpark
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Condición: Hervorragend. Zustand: Hervorragend | Seiten: 892 | Sprache: Englisch | Produktart: Bücher | This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new origina…l concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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EUR 202,95
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Condición: New. In.
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Librería: California Books, Miami, FL, Estados Unidos de AmericaCalifornia Books
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EUR 277,91
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Condición: New.
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Librería: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, AlemaniaBUCHSERVICE / ANTIQUARIAT Lars Lutzer
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EUR 249,90
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Hardcover. Condición: gut. 2022. MicroSystem Based on SiP Technology In deutscher Sprache. pages.
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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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EUR 299,95
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Condición: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore, 2022
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 240,56
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such… as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Idioma: Inglés
Editorial: Springer, Berlin|Springer Nature Singapore|Publishing House of Electronics Industry|Springer, 2022
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Librería: moluna, Greven, Alemaniamoluna
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EUR 192,60
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Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author propos…es some new original concepts and though.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 235,39
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts an…d thoughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it. 892 pp. Englisch.
Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore Mai 2022, 2022
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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EUR 235,39
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters.In Part one, the author proposes some new original concepts and tho…ughts, such as Function Density Law,Si P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging.Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification.Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance forthe research and development of SiP projects.This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case.Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 892 pp. Englisch.
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Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
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EUR 312,51
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Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
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Condición: New. PRINT ON DEMAND.
