9789811698262 - electronics production defects and analysis (springer tracts in electrical and electronics engineering) de kuttiyil thomas, oommen tharakan; gopalan, padma padmanabhan (13 resultados)
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Idioma: Inglés
Editorial: Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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Librería: Books Puddle, New York, NY, Estados Unidos de AmericaBooks Puddle
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EUR 142,19
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Condición: New.
Idioma: Inglés
Editorial: SPRINGER NP, 2022
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Edición internacional
Librería: UK BOOKS STORE, London, LONDO, Reino UnidoUK BOOKS STORE
Contactar con el vendedorVendedor de 5 estrellasEdición internacionalCondición: Usado
EUR 155,42
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Condición: New Books. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested… if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Idioma: Inglés
Editorial: Springer Nature Singapore, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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Librería: Buchpark, Trebbin, AlemaniaBuchpark
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 56,79
Envío por EUR 105,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes… 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
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Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 109,94
Envío por EUR 61,45Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The boo…k includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Idioma: Inglés
Editorial: Springer Nature Singapore, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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Librería: Buchpark, Trebbin, AlemaniaBuchpark
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado
EUR 71,90
Envío por EUR 105,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 10 disponibles
Condición: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher | This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book.… The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Idioma: Inglés
Editorial: Springer Nature Singapore, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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Librería: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, AlemaniaBUCHSERVICE / ANTIQUARIAT Lars Lutzer
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 179,90
Envío por EUR 39,95Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Softcover. Condición: gut. 2023. Electronics Production Defects and Analysis In deutscher Sprache. pages.
Idioma: Inglés
Editorial: Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Impresión bajo demanda
Librería: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 86,24
Envío por EUR 5,50Se envía de Italia a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: new. Questo è un articolo print on demand.
Electronics Production Defects and Analysis
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Idioma: Inglés
Editorial: Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Impresión bajo demanda
Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 99,54
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: Brand New. New. Delivery takes 20-25 days. Print on Demand.
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Idioma: Inglés
Editorial: Springer Nature Singapore, Springer Nature Singapore Apr 2023, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Impresión bajo demanda
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 106,99
Envío por EUR 23,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in t…he book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students. 164 pp. Englisch.
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Idioma: Inglés
Editorial: Springer, Berlin|Springer Nature Singapore|Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Impresión bajo demanda
Librería: moluna, Greven, Alemaniamoluna
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 89,99
Envío por EUR 48,99Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and… presented in the book. The book incl.
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Idioma: Inglés
Editorial: Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
- Tapa blanda
- Impresión bajo demanda
Librería: Majestic Books, Hounslow, Reino UnidoMajestic Books
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 147,22
Envío por EUR 7,58Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 4 disponibles
Condición: New. Print on Demand.
Electronics Production Defects and Analysis (Springer Tracts in Electrical and Electronics Engineering)
Kuttiyil Thomas, Oommen Tharakan; Gopalan, Padma Padmanabhan
Idioma: Inglés
Editorial: Springer, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
- Tapa blanda
- Impresión bajo demanda
Librería: Biblios, frankfurt am main, HESSE, AlemaniaBiblios
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 150,26
Envío por EUR 9,95Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 4 disponibles
Condición: New. PRINT ON DEMAND.
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Idioma: Inglés
Editorial: Springer, Springer Apr 2023, 2023
Serie: Libro 1 de 17 - Springer Tracts in Electrical and Electronics Engineering
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- Impresión bajo demanda
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 106,99
Envío por EUR 60,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the b…ook. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter 'mounting defects' shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 164 pp. Englisch.
