ISBN: 9783659819957 - practical led packaging technology (5 resultados)

Taschenbuch. Condición: Neu. Practical LED Packaging Technology | N. Y. Kim (u. a.) | Taschenbuch | 276 S. | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659819957 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications. 276 pp. Englisch.…

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Kim N. Y.Prof. Nam-Young Kim received two Masters and two Ph.D. degrees from Dept. of Electronic Eng.,SUNY at Buffalo and M.Div. and D.C.E., Midwest University, U.S.A.Dr. Zorigt Chuluunbaatar received the B.S. degree in Electronic En. …

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book comprises of 8 chapters. The chapter 1 starts with a history review LED chip based on III-V compounds and it materials as well as effective benefits of LEDs in comparing with those traditional lighting sources and ends up current market and trends. Chapter 2 provides an overview of the power supply for LED module. The chapter explains advantage and disadvantage of the various topology for power sources. Chapter 3 provides simulation method to characterize LED thermal performance. The characteristics of LEDs and its packaging reliability are presented in chapter 4. Chapter 5 gives an overview and basic knowledge of LED thermal characteristic with measurement principles. Chapter 6 and 7 provides fabrication, packaging, and measurement of the nano-pore silicon-based packaged module in high power applications. Final chapter discusses about next generation LEDs in future applications.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 276 pp. Englisch.…