9783031861048 - Introduction to Microelectronics Advanced Packaging Assurance (Synthesis Lectures on Engineering, Science, and Technology) de Asadizanjani, Navid; Reddy Kottur¿, Hi... (4 resultados)

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

Taschenbuch. Condición: Neu. Introduction to Microelectronics Advanced Packaging Assurance | Navid Asadizanjani (u. a.) | Taschenbuch | Synthesis Lectures on Engineering, Science, and Technology | xix | Englisch | 2026 | Springer | EAN 9783031861048 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. 204 pp. Englisch.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions. 204 pp. Englisch.