9781789854596 - Lead Free Solders (13 resultados)

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HRD. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia. 94 pp. Englisch.

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. KlappentextrnrnThis book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of inte.

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Buch. Condición: Neu. Lead Free Solders | Abhijit Kar (u. a.) | Buch | Gebunden | Englisch | 2019 | IntechOpen | EAN 9781789854596 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand.

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.Books on Demand GmbH, Überseering 33, 22297 Hamburg 94 pp. Englisch.

Buch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of different cutting-edge techniques used for improving the reliability of interconnects manufacturing. Some of the most unconventional topics covered in this book include solder joint formation for microelectronic devices at room temperature and the possibility of soldering ceramic materials, which is limited due to the poor wettability of ceramic substrates with commercial solders following classical soldering techniques. We also discuss the possibilities of nanoscale preparation of solder joints for bringing down the processing temperature so that it does not affect the packaging technologies. Readers will find that precise, systematic discussion of solder joint formation and its interfacial characterization has been depicted for each technique used in different chapters. This book is of interest to both fundamental researchers and also to practicing scientists and will prove invaluable to all those working in industry and academia.