Librería: Ria Christie Collections, Uxbridge, Reino Unido
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Librería: Chiron Media, Wallingford, Reino Unido
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Añadir al carritoPaperback. Condición: New.
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Añadir al carritoCondición: New.
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Añadir al carritoCondición: New. pp. 182.
Idioma: Inglés
Publicado por Springer New York, Springer New York, 2014
ISBN 10: 1489999817 ISBN 13: 9781489999818
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 122,82
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces Open Core Protocol (OCP) not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics. Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate. The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs.
Librería: Mispah books, Redhill, SURRE, Reino Unido
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Idioma: Inglés
Publicado por Springer-Verlag New York Inc., 2014
ISBN 10: 1489999817 ISBN 13: 9781489999818
Librería: THE SAINT BOOKSTORE, Southport, Reino Unido
EUR 129,90
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Añadir al carritoPaperback / softback. Condición: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Idioma: Inglés
Publicado por Springer New York Jun 2014, 2014
ISBN 10: 1489999817 ISBN 13: 9781489999818
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 119,99
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces Open Core Protocol (OCP) not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics. Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate. The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs. 180 pp. Englisch.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 152,52
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Añadir al carritoCondición: New. PRINT ON DEMAND pp. 182.
Librería: Majestic Books, Hounslow, Reino Unido
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Añadir al carritoCondición: New. Print on Demand pp. 182 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Idioma: Inglés
Publicado por Springer, Springer Jun 2014, 2014
ISBN 10: 1489999817 ISBN 13: 9781489999818
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 119,99
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book introduces Open Core Protocol (OCP) not as a conventional hardware communications protocol but as a meta-protocol: a means for describing and capturing the communications requirements of an IP core, and mapping them to a specific set of signals with known semantics. Readers will learn the capabilities of OCP as a semiconductor hardware interface specification that allows different System-On-Chip (SoC) cores to communicate. The OCP methodology presented enables intellectual property designers to design core interfaces in standard ways. This facilitates reusing OCP-compliant cores across multiple SoC designs which, in turn, drastically reduces design times, support costs, and overall cost for electronics/SoCs.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 180 pp. Englisch.