Isbn: 9781441942241 - silicon devices and process integration: deep submicron and nano-scale technologies (13 resultados)

Condición: New.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.…

Condición: New. In English.

Taschenbuch. Condición: Neu. Silicon Devices and Process Integration | Deep Submicron and Nano-Scale Technologies | Badih El-Kareh | Taschenbuch | xxvi | Englisch | 2010 | Springer | EAN 9781441942241 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condición: New. pp. 624.

Paperback. Condición: Like New. Like New. book.

Condición: As New. Unread book in perfect condition.

Condición: new. Questo è un articolo print on demand.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author's industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include:A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon;State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS;CMOS-only applications, such as subthreshold current and parasitic latch-up;Advanced Enabling processes and process integration.This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. 624 pp. Englisch.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Focuses on process integration techniques and technologyAddresses both raw silicon material and demonstrates their use in componentsSilicon Devices and Process Integration covers state-of-the-art silicon device.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book includes discussion of silicon materials and electrical engineering properties as used in the design of analog components. Due to the author's background at Texas Instruments, the book will have an emphasis on newer process integration techniques and technology to help professional engineers in the field understand and develop electrical components.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 624 pp. Englisch.…

Condición: New. Print on Demand pp. 624 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Condición: New. PRINT ON DEMAND pp. 624.