Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 115,63
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Librería: California Books, Miami, FL, Estados Unidos de America
EUR 118,00
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 120,37
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Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 115,54
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Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 115,53
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Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 126,64
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Idioma: Inglés
Publicado por Springer US, Springer US, 2003
ISBN 10: 140207705X ISBN 13: 9781402077050
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 112,77
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 106,99
Cantidad disponible: 2 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness. 180 pp. Englisch.
Librería: moluna, Greven, Alemania
EUR 92,27
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Añadir al carritoGebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials.
Librería: preigu, Osnabrück, Alemania
EUR 95,70
Cantidad disponible: 5 disponibles
Añadir al carritoBuch. Condición: Neu. Thin-Film Capacitors for Packaged Electronics | Eugene J. Rymaszewski (u. a.) | Buch | xv | Englisch | 2003 | Springer US | EAN 9781402077050 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Idioma: Inglés
Publicado por Springer US, Springer US Nov 2003, 2003
ISBN 10: 140207705X ISBN 13: 9781402077050
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 106,99
Cantidad disponible: 1 disponibles
Añadir al carritoBuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structuresElectrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz)Process modeling to determine stable operating pointsPrevention of metal (Cu) diffusion into the dielectricMeasurements and modeling of the dielectric micro-roughness.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 180 pp. Englisch.