9780792397144 - from contamination to defects, faults and yield loss: simulation and applications: 5 (frontiers in electronic testing, 5) de khare, jitendra b.; maly, wojciech (17 resultados)
Idioma: Inglés
Editorial: Kluwer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: Zubal-Books, Since 1961, Cleveland, OH, Estados Unidos de AmericaZubal-Books, Since 1961
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Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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hardcover. Condición: New. In shrink wrap. Looks like an interesting title.
Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Condición: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, th…is greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.
Idioma: Inglés
Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Condición: As New. Unread book in perfect condition.
Idioma: Inglés
Editorial: Kluwer Academic Publishers 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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Condición: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages…, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . .
Idioma: Inglés
Editorial: Kluwer Academic Publishers 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Condición: New. States that over the years there has been a large increase in the functionality available on a single integrated circuit. This book focuses on the core of the interface between manufacturing and testing, ie, the contamination-defect-fault relationship. Series: Frontiers in Electronic Testing. Num Pages: 166 pages…, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 234 x 156 x 11. Weight in Grams: 930. . 1996. Hardback. . . . . Books ship from the US and Ireland.
Idioma: Inglés
Editorial: Springer US, Springer US 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this grea…ter functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing.
Idioma: Inglés
Editorial: Springer US Apr 1996 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , AlemaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. Ho…wever, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield. Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing. From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems. Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing. 172 pp. Englisch.
Idioma: Inglés
Editorial: Springer US 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: moluna, Greven, , Alemaniamoluna
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better…packing efficiency. However, this gre.
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Editorial: Springer 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Buch. Condición: Neu. From Contamination to Defects, Faults and Yield Loss | Simulation and Applications | Jitendra B. Khare (u. a.) | Buch | Frontiers in Electronic Testing | Einband - fest (Hardcover) | Englisch | 1996 | Springer | EAN 9780792397144 | Verantwortliche Person für die EU: Springer Nature Customer Service Center G…mbH, Europaplatz 3, 69115 Heidelberg, productsafety[at]springernature[dot]com | Anbieter: preigu Print on Demand.
Idioma: Inglés
Editorial: Springer US, Springer US Apr 1996 1996
Serie: Frontiers in Electronic Testing, Libro 28 de 40. Libro 28 de 40 - Frontiers in Electronic Testing
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. Howeve…r, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield.Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing.From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems.Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing. 172 pp. Englisch.
