Isbn: 9780792384854 - the simulation of thermomechanically induced stress in plastic encapsulated ic packages (18 resultados)

gebundene Ausgabe. Condición: Gut. 134 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 400.…

Hardcover. Condición: Very Good. Sorry, No international shipping on this item.Ex-Library hardcover in very nice condition with the usual markings and attachments. Except for library markings, interior clean and unmarked. Tight binding.

Condición: New. In English.

Condición: New.

Condición: New.

Condición: New. pp. 164.

Condición: New. Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems. Num Pages: 153 pages, biography. BIC Classification: TD; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 244 x 170 x 11. Weight in Grams: 410. . 1999. Hardback. . . . . …

Condición: New. Deals with understanding the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. This book emphasises on the correct use of finite element tools for these problems. Num Pages: 153 pages, biography. BIC Classification: TD; TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 244 x 170 x 11. Weight in Grams: 410. . 1999. Hardback. . . . . Books ship from the US and Ireland. …

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.…

Condición: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.…

Condición: As New. Unread book in perfect condition.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: As New. Unread book in perfect condition.

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000. 164 pp. Englisch.…

Gebunden. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done? Firs.…

Condición: New. Print on Demand pp. 164 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condición: New. PRINT ON DEMAND pp. 164.

Buch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time. How can this be done Firstly, package structures, materials, and manufacturing processes must be optimised. Secondly, it is necessary to predict the likely failures and behaviour of parts before manufacture, whilst minimising the amount of time and money invested in undertaking costly experimental trials. In a high volume production environment, any design improvement that increases yield and reliability can be of immense benefit to the manufacturer. Components and systems need to be packaged to protect the IC from its environment. Encapsulating devices in plastic is very cheap and has the advantage of allowing them to be produced in high volume on an assembly line. Currently 95% of all ICs are encapsulated in plastic. Plastic packages are robust, light weight, and suitable for automated assembly onto printed circuit boards. They have developed from low pincount (14-28 pins) dual-in-line (DIP) packages in the 1970s, to fine pitch PQFPs (plastic quad flat pack) and TQFPs (thin quad flat pack) in the 1980s-1990s, with leadcounts as high as 256. The demand for PQFPs in 1997 was estimated to be 15 billion and this figure is expected to grow to 20 billion by the year 2000.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 164 pp. Englisch.…