Totta a (15 resultados)
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Librería: Friends of Poughkeepsie Library, Poughkeepsie, NY, Estados Unidos de AmericaFriends of Poughkeepsie Library
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EUR 44,43
Envío por EUR 5,17Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: Very Good. 1st Edition. Signed by Paul A. Totta. Boards with superficial wear, light edge wear. Spine with some creasing toward tips. Internally clean and unmarked. Light soil to textblock edges. Due to weight of book, international orders cannot be accepted. Shelf 5c. Signed by Author(s).
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Librería: Forgotten Books, London, Reino UnidoForgotten Books
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EUR 19,63
Gastos de envío gratisSe envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Paperback. Condición: New. Print on Demand. Embark on a captivating journey with this memoir as the author, born into an impoverished family on the island of Santiago, navigates a male-dominated society and the challenges of colonialism. The author's groundbreaking dance performances and fearless leadership as a young woman set…the stage for a life filled with both triumphs and tribulations. The narrative spans the author's childhood in a modest palhota, the impact of colonial rule on her people, and a transformative love affair that leads to her departure from her homeland. Along the way, the author grapples with issues of racial prejudice and stereotypes, ultimately emerging as a symbol of defiance and resilience. This book offers a rare glimpse into the life of a remarkable woman who overcame adversity to become a celebrated artist and advocate for social change. Its insights into the intersection of race, gender, and colonialism continue to resonate powerfully, making this memoir an essential read for anyone seeking a deeper understanding of this complex and tumultuous period in history. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item.
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Librería: moluna, Greven, , Alemaniamoluna
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EUR 48,37
Envío por EUR 48,99Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New.
Editorial: Szabadi T Nagykanizsa 1995
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Librería: Untje.com, Roeselare, , BelgicaUntje.com
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Aceptable
EUR 10,53
Envío por EUR 50,00Se envía de Belgica a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Paperback. Condición: Good. 49 p. ill. ; 21 cm Leopold J. Vermeiren ; eszperanto?bo?l fordi?totta Szabadi Tibor ; a rajzokat kész. Szabadiné Mo?zes Gyo?ngyi. Hungarian.
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Librería: preigu, Osnabrück, Alemaniapreigu
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EUR 50,25
Envío por EUR 70,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 5 disponibles
Taschenbuch. Condición: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 62,15
Envío por EUR 72,32Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and inter…connection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
Contactar con el vendedorVendedor de 4 estrellasCondición: Usado - Como Nuevo
EUR 194,31
Envío por EUR 28,93Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Librería: Basi6 International, Irving, TX, Estados Unidos de AmericaBasi6 International
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 262,34
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Librería: Forgotten Books, London, Reino UnidoForgotten Books
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 19,63
Gastos de envío gratisSe envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Paperback. Condición: New. Print on Demand. This book is a reproduction of an important historical work, digitally reconstructed using state-of-the-art technology to preserve the original format. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in the book. print-on-demand item….
Editorial: Off. da Ilustracao Portugueza, Lisboa 1912
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- Primera edición
Librería: Veronica's Books, Gig Harbor, WA, Estados Unidos de AmericaVeronica's Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Regular
EUR 106,63
Envío por EUR 5,61Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Paperback. Condición: Fair. 1st Edition. Original publication, text in Portuguese. ***Missing front cover, pages are age toned but still tight and unread as evident by pages still being unopened/uncut. Scarce, historical text. 318pp + fold-out. Book.
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Librería: Xerxes Fine and Rare Books and Documents, Glen Head, NY, Estados Unidos de AmericaXerxes Fine and Rare Books and Documents
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Bueno
EUR 66,64
Envío por EUR 5,13Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: VG. Lisboa 1913 Bandeira & Brito. Subsidios veridicos para a historia do assalto ao Petit Trianon do Gimnasio Dramatico por dois revolucionarios in civis. In Portuguese. 12mo., 43pp., iIlustracoes de H. Collomb, original pictorial wraps (hand with blood-dripping knife). Near VG cover foxed and a bit soiled.
Editorial: Off. da Ilustracao Portugueza, Lisboa 1912
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- Primera edición
Librería: Veronica's Books, Gig Harbor, WA, Estados Unidos de AmericaVeronica's Books
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Aceptable
EUR 199,92
Envío por EUR 5,61Se envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Paperback. Condición: Good. 1st Edition. Original publication, text in Portuguese. Chipping and mild smudging to cover, pages are age toned but still tight and unread as evident by pages still being unopened. Scarce, historical text. 318pp + fold-out map. Book.
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Librería: Gyan Books Pvt. Ltd., Delhi, , IndiaGyan Books Pvt. Ltd.
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 35,25
Gastos de envío gratisSe envía de India a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Leather Bound. Condición: New. Language: Portuguese. Language: Portuguese. Presenting an Exquisite Leather-Bound Edition, expertly crafted with Original Natural Leather that gracefully adorns the spine and corners. The allure continues with Golden Leaf Printing that adds a touch of elegance, while Hand Embossing on the rounded s…pine lends an artistic flair. This masterpiece has been meticulously reprinted in 2024, utilizing the invaluable guidance of the original edition published many years ago in 1912. The contents of this book are presented in classic black and white. Its durability is ensured through a meticulous sewing binding technique, enhancing its longevity. Imprinted on top-tier quality paper. A team of professionals has expertly processed each page, delicately preserving its content without alteration. Due to the vintage nature of these books, every page has been manually restored for legibility. However, in certain instances, occasional blurriness, missing segments, or faint black spots might persist. We sincerely hope for your understanding of the challenges we faced with these books. Recognizing their significance for readers seeking insight into our historical treasure, we've diligently restored and reissued them. Our intention is to offer this valuable resource once again. We eagerly await your feedback, hoping that you'll find it appealing and will generously share your thoughts and recommendations. Lang: - Portuguese, Pages: - 342, Print on Demand. If it is a multi-volume set, then it is only a single volume. We are specialised in Customisation of books, if you wish to opt different color leather binding, you may contact us. This service is chargeable. Product Disclaimer: Kindly be informed that, owing to the inherent nature of leather as a natural material, minor discolorations or textural variations may be perceptible. Explore the FOLIO EDITION (12x19 Inches): Available Upon Request. 342 342.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , AlemaniaBuchWeltWeit Ludwig Meier e.K.
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 53,49
Envío por EUR 23,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external…wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 53,49
Envío por EUR 60,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiri…ng and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch.
