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Condición: New. pp. 281 1st ed. 2019 edition NO-PA16APR2015-KAP.

Paperback. Condición: Brand New. 300 pages. 9.25x6.10x0.63 inches. In Stock.

Condición: New. 1st ed. 2019 edition NO-PA16APR2015-KAP.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.…

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.…

Taschenbuch. Condición: Neu. VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms | 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8-10, 2018, Revised and Extended Selected Papers | Nicola Bombieri (u. a.) | Taschenbuch | xiv | Englisch | 2020 | Springer | EAN 9783030234270 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

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Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective wayon different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.…

Condición: New. pp. 220.

Hardcover. Condición: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics.By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective wayon different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.…

Hardcover. Condición: Brand New. 244 pages. 9.25x6.25x0.75 inches. In Stock.

Condición: New. pp. 242.

Taschenbuch. Condición: Neu. Smart Systems Integration and Simulation | Nicola Bombieri (u. a.) | Taschenbuch | x | Englisch | 2018 | Springer | EAN 9783319801308 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condición: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book-presents new methods and tools for the integration and simulation of smart devices. The design approach described in this book explicitly accounts for integration of Smart Systems components and subsystems as a specific constraint. It includes methodologies and EDA tools to enable multi-disciplinary and multi-scale modeling and design, simulation of multi-domain systems, subsystems and components at all levels of abstraction, system integration and exploration for optimization of functional and non-functional metrics. By covering theoretical and practical aspects of smart device design, this book targets people who are working and studying on hardware/software modelling, component integration and simulation under different positions (system integrators, designers, developers, researchers, teachers, students etc.). In particular, it is a good introduction to people who have interest in managing heterogeneous components in an efficient and effective wayon different domains and different abstraction levels. People active in smart device development can understand both the current status of practice and future research directions. · Provides a comprehensive overview of smart systems design, focusing on design challenges and cutting-edge solutions; · Enables development of a co-simulation and co-design environment that accounts for the peculiarities of the basic subsystems and components to be integrated; · Describes development of modeling and design techniques, methods and tools that enable multi-domain simulation and optimization at various levels of abstraction and across different technological domains.…

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Condición: new. Questo è un articolo print on demand.

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PF. Condición: New. This item is printed on demand. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems. 281 pp. Englisch. …

Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018.The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papersdiscuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies.In particular they addresscutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems. 300 pp. Englisch.…

Condición: New. Print on Demand pp. 281.

Condición: new. Questo è un articolo print on demand.

Condición: New. Print on Demand.