Hanim azmah (11 resultados)

Condición: New. pp. 272.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Taschenbuch. Condición: Neu. Lead Free Solder | Interfacial Reaction between Sn-37Pb and Sn-4Ag-0.5Cu Solders on Different Surface Finishes | Azmah Hanim Mohamed Ariff | Taschenbuch | 272 S. | Englisch | 2013 | LAP LAMBERT Academic Publishing | EAN 9783659379482 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition. 272 pp. Englisch.…

Kartoniert / Broschiert. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Jabalamelian SaeedMSC Saeed Jabalamelian has obtained bachelor degree in Mechanical Engineering from Malek Ashtar University of Technology.He has studied the behavior of materials in high strain rate, high temperature deformation and.…

Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition.…

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Mohamed Ariff Azmah HanimDr Azmah Hanim was born in Penang, Malaysia. She obtained her PhD in Mechanical Engineering from University Technology Malaysia in 2008. After working as a senior material technology development engineer in I.…

Condición: New. Print on Demand pp. 272 2:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on Creme w/Gloss Lam.

Condición: New. PRINT ON DEMAND pp. 272.

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The industry of electronic packaging is fast moving towards lead-free solders because of environmental and health concerns. Among the various surface finishes available, electroless nickel/ immersion gold (ENIG) is the most appealing at the moment. Unfortunately, the presence of phosphorus (P) may complicate the interfacial reactions and may affect the reliability of the solder joint. In order to minimise this problem, an alternative surface finish were introduced, in which a layer of palladium is introduced between the nickel and gold layers using electroless deposition. This book explores this question in detail with the effect of annealing and aging of Sn-37Pb eutectic solder and Sn-4Ag-0.5Cu solder on ENIG and ENEPIG surface finishes. Other parameters involved are P content in Ni layer and the Ni layer thickness. The intermetallics (IMC) were characterized in terms of thickness, morphology and composition.OmniScriptum SRL, Str. Armeneasca 28/1, office 1, 2012 Chisinau 272 pp. Englisch.…