gutmann ronald (38 resultados)

Hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!

Hardcover. Condición: Poor. Different than pictured, blue hardcover with no dust jacket. Cover has some very light rubbing and leftover price sticker on back, otherwise looks bright and sharp. Front hinge cracked on title page, but other than this binding is solid. Marker enscription on bottom of textblock, otherwise pages are clean, crisp, and bright. Overall in very decent condition aside from the one crack, a great reading copy.

Hardcover. Condición: As New. 1st Edition. First Edition. Original boards. As New. No Dust Jacket.

Staple Bound. Condición: Near Fine. Unpaginated white and black staple bound soft cover. Small 3/4" stain on bottom right area of front cover. Pencil marks on cover page. Includes brief descriptions of further manuals on Integrated Electronics, Integrated Circuit Process, Integrated Circuit Devices and Components, Operational Amplifiers, Active Filters Using Operational Amplifiers, Combinational Logic Design, Logic Design with TTL, Semiconductor Memories, and Display Devices. 9 1/4 x 7 1/2".

Condición: Very Good. Hardcover, [xiv], 229 pages. Very Good condition. Size 9.5"x6.25". "The focus of this book is to merge the complex chemical-mechanical planarization (CMP) models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning." Book has moderate exterior shelfwear/soiling. Binding is tight. Gift inscription on front fly, text else Fine condition, clean and unmarked.

Hardcover. Condición: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.

Hardcover. Condición: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.

paperback. Condición: New. In shrink wrap. Looks like an interesting title!

Paper Back. Condición: Very Good+. No Jacket. Reprint. SC staple-bound w/no title on spine; yellow w/black; some rub w/clean, tight pgs. Pencil marks on front cover and cover page. Operation Update Series in Integrated Circuit Technology and Applications.

Condición: New. Leading experts address questions of public and private roles in assessing, managing, and mitigating major risks to public health and safety in light of the devastation caused by Hurricane Katrina.&Uumlber den AutorRonald J. Daniels.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: New. pp. xxviii + 337 1st Edition.

Condición: New. pp. xxviii + 337 Illus.

Condición: New. In.

Taschenbuch. Condición: Neu. Wafer Level 3-D ICS Process Technology | Chuan Seng Tan (u. a.) | Taschenbuch | xii | Englisch | 2010 | Springer Us | EAN 9781441945624 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Buch. Condición: Neu. Neuware -Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry¿s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today¿s trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren¿t vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 376 pp. Englisch.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.

Hardcover. Condición: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.

Paperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Encuadernación de tapa blanda. Condición: Bien. Estado de la sobrecubierta: Bien. Situation Esthetics: Impermanent Art and the Seventies Audience John Gutmann: A Transported Vision Carol Squiers Beuys: The Twilight of the Idol Benjamin H. D. Buchloh Willem de Kooning at the Pittsburgh International David Carrier Myron Stout s Complexity in Simplicity Tiffany Bell Dance : Lucinda Childs, Philip Glass and Sol LeWitt Deborah Perlberg David Reed s Paintings James Sherry Myth, Thermadorians and Solipsists Nicolas Calas COLUMNS FEATURES REVIEWS NEW YORK Stuart Morgan on Alice Aycock Stuart Morgan on Marco Bagnoli Stuart Morgan on Farrell Brickhouse Jeff Perrone on Robert Kushner Jeff Perrone on Willem de Kooning Jeff Perrone on Stefan Hirsch Jeff Perrone on Ron Gorchov Jeff Perrone on John McLaughlin Carrie Rickey on Philip Guston Carrie Rickey on Jennifer Bartlett Carrie Rickey on Steven Gianakos Carrie Rickey on Animals Living in Cities Hal Foster on Max Neuhaus Hal Foster on Richards Ruben Hal Foster on Lydia Dona Margaret Sheffield on Irving Petlin Margaret Sheffield on Don Gummer Judith Lopes Cardozo on Conrad Atkinson and Victor Burgin Judith Lopes Cardozo on Ed Kerns CAMBRIDGE Ronald J. Onorato on Corners DALLAS Fred Hoffman on Vernon Fisher LONDON Adrian Searle on Narrative Paintings Adrian Searle on John Hoyland LOS ANGELES Fred Hoffman on Chris Burden Fred Hoffman on DeWain Valentine Richard Armstrong on Jon Peterson SANTA BARBARA Richard Armstrong on Tom Wudl Richard Armstrong on Dialogue/Discourse/Research.

Condición: New. In.

Condición: New. In.

Condición: New. In.

Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.