Librería: ThriftBooks-Dallas, Dallas, TX, Estados Unidos de America
EUR 7,34
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Good. No Jacket. Julie Evans. Sarah Schultz Ilustrador. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Librería: ThriftBooks-Atlanta, AUSTELL, GA, Estados Unidos de America
EUR 7,34
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Very Good. No Jacket. Julie Evans. Sarah Schultz Ilustrador. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Idioma: Inglés
Publicado por Meyer & Meyer Sport, Limited, 2015
ISBN 10: 1782550690 ISBN 13: 9781782550693
Librería: Better World Books: West, Reno, NV, Estados Unidos de America
EUR 9,92
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Librería: One Planet Books, Columbia, MO, Estados Unidos de America
Original o primera edición
EUR 6,58
Cantidad disponible: Más de 20 disponibles
Añadir al carritopaperback. Condición: Like New. Julie Evans. Sarah Schultz Ilustrador. First Edition. Ships in a BOX from Central Missouri! Like Brand NEW. No tears, highlighting or writing because it's never been used! May have minor shelf wear. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 10,51
Cantidad disponible: 13 disponibles
Añadir al carritoCondición: As New. Julie Evans. Sarah Schultz Ilustrador. Unread book in perfect condition.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 11,49
Cantidad disponible: 13 disponibles
Añadir al carritoCondición: New. Julie Evans. Sarah Schultz Ilustrador.
Librería: Your Online Bookstore, Houston, TX, Estados Unidos de America
EUR 13,82
Cantidad disponible: 1 disponibles
Añadir al carritopaperback. Condición: New. Julie Evans. Sarah Schultz Ilustrador.
Librería: Textbooks_Source, Columbia, MO, Estados Unidos de America
Original o primera edición
EUR 10,45
Cantidad disponible: Más de 20 disponibles
Añadir al carritopaperback. Condición: New. Julie Evans. Sarah Schultz Ilustrador. First Edition. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
Idioma: Inglés
Publicado por Association of Christian Schools International, 2008
ISBN 10: 1583310878 ISBN 13: 9781583310878
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America
EUR 16,70
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: new. Julie Evans. Sarah Schultz Ilustrador. Hardcover. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
EUR 20,56
Cantidad disponible: 13 disponibles
Añadir al carritoCondición: New. Julie Evans. Sarah Schultz Ilustrador.
Idioma: Inglés
Publicado por Association of Christian Schools International, 2008
ISBN 10: 1583310878 ISBN 13: 9781583310878
Librería: AussieBookSeller, Truganina, VIC, Australia
EUR 37,01
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover. Condición: new. Julie Evans. Sarah Schultz Ilustrador. Hardcover. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Librería: Bay State Book Company, North Smithfield, RI, Estados Unidos de America
EUR 88,19
Cantidad disponible: 1 disponibles
Añadir al carritoCondición: very_good.
EUR 72,66
Cantidad disponible: 13 disponibles
Añadir al carritoCondición: As New. Julie Evans. Sarah Schultz Ilustrador. Unread book in perfect condition.
EUR 82,21
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: Very Good. Same / next day dispatch (Monday - Friday),
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 121,06
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 114,33
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 129,77
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 114,32
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 139,87
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: INDOO, Avenel, NJ, Estados Unidos de America
EUR 142,20
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
Librería: myVend, Altötting, Alemania
EUR 129,90
Cantidad disponible: 1 disponibles
Añadir al carritoHardcover Feb 28, 2001. Condición: Used: Like New. Inkl. Rechnung nach §19; Buch stammt aus aufgelà ster Buchsammlung; Label, Stempel und Notizen mà glich.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 127,08
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 147,40
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. pp. 420.
Librería: PBShop.store UK, Fairford, GLOS, Reino Unido
EUR 151,29
Cantidad disponible: 15 disponibles
Añadir al carritoPAP. Condición: New. New Book. Shipped from UK. Established seller since 2000.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 151,16
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: new.
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de America
EUR 162,11
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: GreatBookPricesUK, Woodford Green, Reino Unido
EUR 151,28
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New.
EUR 95,70
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Product Integrity and Reliability in Design | Jillian Y. Evans (u. a.) | Taschenbuch | xiv | Englisch | 2012 | Springer London | EAN 9781447110651 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Idioma: Inglés
Publicado por John Wiley & Sons Inc, New York, 1995
ISBN 10: 0471594369 ISBN 13: 9780471594369
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America
Original o primera edición
EUR 176,70
Cantidad disponible: 1 disponibles
Añadir al carritoPaperback. Condición: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 163,08
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. In.