EUR 37,97
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Añadir al carritoCondición: New.
EUR 39,80
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Librería: Books Puddle, New York, NY, Estados Unidos de America
EUR 46,70
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. 1st edition NO-PA16APR2015-KAP.
Librería: Ria Christie Collections, Uxbridge, Reino Unido
EUR 37,98
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Añadir al carritoCondición: New. In English.
EUR 37,45
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Añadir al carritoCondición: New.
EUR 43,15
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Añadir al carritoCondición: As New. Unread book in perfect condition.
Idioma: Inglés
Publicado por Springer International Publishing, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 35,30
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 43,59
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 44,71
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Añadir al carritoCondición: New. PRINT ON DEMAND.
Idioma: Inglés
Publicado por Springer International Publishing Dez 2007, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 35,30
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing. 104 pp. Englisch.
Idioma: Inglés
Publicado por Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Librería: moluna, Greven, Alemania
EUR 32,69
Cantidad disponible: Más de 20 disponibles
Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices .