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Sinopsis
Language:Chinese.paperback.Pub Date:2024-10.publisher:Chemical Industry Press.description:Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of elect
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Advanced electronic packaging technology(Chinese Edition)
Publicado por
Chemical Industry Press, 2024
ISBN 10: 7122458822
ISBN 13: 9787122458827
Nuevo
paperback
Librería: liu xing, Nanjing, JS, China
Calificación del vendedor: 5 de 5 estrellas
paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi. Nº de ref. del artículo: DT050389
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