Advanced electronic packaging technology de jing ning (1 resultados)
- Tapa blanda
Librería: liu xing, Nanjing, JS, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 156,05
Envío por EUR 16,10Se envía de China a Estados Unidos de AmericaCantidad disponible: 1 disponible
paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. including important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.…
