9787122458827 - advanced electronic packaging technology(chinese edition) de du jing ning (1 resultados)
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Librería: liu xing, Nanjing, Chinaliu xing
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 151,28
Envío por EUR 15,60Se envía de China a Estados Unidos de AmericaCantidad disponible: 1 disponibles
paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2024-10 Pages: 236 Publisher: Chemical Industry Press This book systematically and comprehensively summarizes the fundamental knowledge and technologies of modern electronic packaging science. Part I provides an overview of electronic packaging technologies. includ…ing important packaging fundamentals such as wire bonding. automatic tape bonding. flip chip solder joint bonding. microbump bonding. and CUCU direct bonding. Part II introduces the circuit desi.
