RF and Microwave Microelectronics Packaging - Tapa blanda

 
9781489983244: RF and Microwave Microelectronics Packaging
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ISBN 10: 1489983244 ISBN 13: 9781489983244
Editorial: Springer, 2014

Sinopsis

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

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De la contraportada

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

Bringing together years of experience in the field, lead authors Ken Kuang, Franklin Kim and Sean Cahill have brought together leading engineers working in electronics to explore the most recent developments of microelectronic packaging. RF and Microwave Microelectronics Packaging also:

  • Presents methods and techniques used for measuring and testing of the electronic materials properties.
  • Engages in an in-depth discussion of ceramic materials for RF/MW packaging.
  • Offers numerical simulation methods and techniques used in analysis of electronic devices and materials.
  • Discusses thermal management issues for RF/MW packaging.
  • Creates a RF/Microwave Packaging Roadmap for Portable Devices.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2014
Idioma
Inglés
ISBN 10 
1489983244
ISBN 13 
9781489983244
Encuadernación
Tapa blanda
Número de páginas
304
Editor
Kuang Ken, Kim Franklin, Cahill Sean S.
Contacto del fabricante
no disponible
Persona responsable
no disponible

Otras ediciones populares con el mismo título

9781441909831: RF and Microwave Microelectronics Packaging

Edición Destacada

ISBN 10:  1441909834 ISBN 13:  9781441909831
Editorial: Springer, 2009
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