Sinopsis
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer.
"Sinopsis" puede pertenecer a otra edición de este libro.
Reseña del editor
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Reseña del editor
This handbook provides a comprehensive treatment of area-array interconnections for both chips and microelectronic packages in terms of optimizing densification, functionality and reliability. It provides comparisons with alternative and competing technologies, clearly defining cost versus benefit tradeoffs and strategies. Process details are defined in the order of their typical manufacturing sequence, indicating tooling requirements and potential yield detractors. In addition, the handbook has individual chapters devoted to supporting disciplines that play a key role in satisfying the requirements of microelectronic package applications: efficient thermal-dissipation techniques, metallurgical and mechanical characteristics of interconnections and electrical design strategies. Area-array technology at both die and chip carrier levels offers the best opportunity of satisfying the demanding performance requirements that users at all levels of the product spectrum have come to expect. This handbook fully describes the 'how and why' of the inherent elements of area-array technology that give rise to enhanced electrical and thermal dissipation capabilities, and densification to accommodate demanding design requirements, while at the same time accommodating size and cost reductions to enhance comfort and portability. This handbook is the only book that provides a complete and integrated treatment which includes all the aspects of area-array microelectronics. Each chapter is self contained, written in a clear, concise, easy-to-understand manner. It sets forth fundamentals followed by the application of those principles making prior knowledge of the subject material unnecessary in order to utilize this reference. The handbook will serve as an excellent text or companion reference for a variety of electronic packaging courses or workshops. FEATURES: * describes all the key elements of microelectronic packaging technology; * organized into three categories: die, chip carrier, and support technologies; * presents information in a clear and concise manner; * can be utilized as a textbook or companion reference for a range of microelectronic packaging courses; * each chapter is self-contained; * provides guidelines and strategies for making microelectronic packaging choices. ABOUT THE EDITORS: Considered 'pioneers' in the field of microelectronics packaging, Karl Puttlitz and Paul Totta represent 80 years of experience in all aspects of the technology. They were key forces in the definition and implementation of flip-chip technology from its very inception at IBM and through its evolution during the past four decades. As major contributors in the development and manufacture of various microelectronics chip-carrier packages, the authors are frequently invited to speak at universities, international conferences and workshops.
"Sobre este título" puede pertenecer a otra edición de este libro.
Otras ediciones populares con el mismo título
Resultados de la búsqueda para Area Array Interconnection Handbook
Imagen del vendedor
Area Array Interconnection Handbook
Publicado por
Springer US Nov 2012, 2012
ISBN 10: 146135529X
ISBN 13: 9781461355298
Nuevo
Taschenbuch
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. 1332 pp. Englisch. Nº de ref. del artículo: 9781461355298
Comprar nuevo
EUR 53,49
Envío por EUR 23,00
Se envía de Alemania a Estados Unidos de America
Se envía de Alemania a Estados Unidos de America
Cantidad disponible: 2 disponibles
Imagen del vendedor
Area Array Interconnection Handbook
Librería: moluna, Greven, Alemania
Calificación del vendedor: 4 de 5 estrellas
Condición: New. Nº de ref. del artículo: 4193759
Comprar nuevo
EUR 48,37
Envío por EUR 48,99
Se envía de Alemania a Estados Unidos de America
Se envía de Alemania a Estados Unidos de America
Cantidad disponible: Más de 20 disponibles
Imagen del vendedor
Area Array Interconnection Handbook
Publicado por
Springer US, Chapman And Hall/CRC Nov 2012, 2012
ISBN 10: 146135529X
ISBN 13: 9781461355298
Nuevo
Taschenbuch
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 1332 pp. Englisch. Nº de ref. del artículo: 9781461355298
Comprar nuevo
EUR 53,49
Envío por EUR 60,00
Se envía de Alemania a Estados Unidos de America
Se envía de Alemania a Estados Unidos de America
Cantidad disponible: 1 disponibles
Imagen del vendedor
Area Array Interconnection Handbook
Librería: preigu, Osnabrück, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. Area Array Interconnection Handbook | Paul A. Totta (u. a.) | Taschenbuch | 2 Taschenbücher | Englisch | 2012 | Springer US | EAN 9781461355298 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Nº de ref. del artículo: 105410987
Comprar nuevo
EUR 50,25
Envío por EUR 70,00
Se envía de Alemania a Estados Unidos de America
Se envía de Alemania a Estados Unidos de America
Cantidad disponible: 5 disponibles
Imagen del vendedor
Area Array Interconnection Handbook
Publicado por
Springer US, Springer New York, 2012
ISBN 10: 146135529X
ISBN 13: 9781461355298
Nuevo
Taschenbuch
Librería: AHA-BUCH GmbH, Einbeck, Alemania
Calificación del vendedor: 5 de 5 estrellas
Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Microelectronic packaging has been recognized as an important 'enabler' for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects. Nº de ref. del artículo: 9781461355298
Comprar nuevo
EUR 62,15
Envío por EUR 72,32
Se envía de Alemania a Estados Unidos de America
Se envía de Alemania a Estados Unidos de America
Cantidad disponible: 1 disponibles