Librería: preigu, Osnabrück, Alemania
EUR 259,45
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Añadir al carritoTaschenbuch. Condición: Neu. Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications | Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023) | Vikrant Bhateja (u. a.) | Taschenbuch | Lecture Notes in Electrical Engineering | xiii | Englisch | 2025 | Springer | EAN 9789819784240 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 310,11
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 230,32
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Librería: moluna, Greven, Alemania
EUR 250,30
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.
Idioma: Inglés
Publicado por Springer, Palgrave Macmillan Dez 2025, 2025
ISBN 10: 9819784247 ISBN 13: 9789819784240
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 299,59
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society. 540 pp. Englisch.
Idioma: Inglés
Publicado por Springer, Springer Dez 2025, 2025
ISBN 10: 9819784247 ISBN 13: 9789819784240
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 299,59
Cantidad disponible: 1 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 - 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today's society.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 540 pp. Englisch.