9786204740263 - a comprehensive study on heat transfer in electronic cooling systems: flow optimization of heat sinks for different al/cu compositions de hanumanthrappa, ramesha; k, ananda g; r, varun k (5 resultados)
- Tapa blanda
Librería: preigu, Osnabrück, Alemaniapreigu
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 52,55
Envío por EUR 70,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 5 disponibles
Taschenbuch. Condición: Neu. A Comprehensive Study on Heat Transfer in Electronic Cooling Systems | Flow optimization of heat sinks for different Al/Cu compositions | Ramesha Hanumanthrappa (u. a.) | Taschenbuch | Englisch | 2022 | LAP LAMBERT Academic Publishing | EAN 9786204740263 | Verantwortliche Person für die EU: preigu Gm…bH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
- Tapa blanda
- Impresión bajo demanda
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 60,90
Envío por EUR 23,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount… of heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise. 128 pp. Englisch.
- Tapa blanda
- Impresión bajo demanda
Librería: moluna, Greven, Alemaniamoluna
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 49,92
Envío por EUR 48,99Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generat…e a huge amount of heat during operation.
- Tapa blanda
- Impresión bajo demanda
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 60,90
Envío por EUR 60,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of…heat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 128 pp. Englisch.
- Tapa blanda
- Impresión bajo demanda
Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 61,63
Envío por EUR 61,05Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In electronic cooling applications, a TE cooler serves as a device for transporting heat away from a surface that has a temperature higher than the ambient temperature. Electronic devices such as PC processors generate a huge amount of h…eat during operation poses a great thermal management challenge because reliable operation temperature for electronic devices has to be maintained. In most cases, the maximum electronic device junction temperature needs to be held at less than 85°C for reliable operation. The maximum heat flow from a high-performance electronic package can be about 200 W and is still constantly increasing. Conventional passive cooling technologies using air or water as working fluid, such as the microchannel sink, cannot fully meet the heat dissipation requirement and active cooling methods should be applied. Due to the limited installation space in electronic packages, conventional bulk cooling systems are too big. TE coolers combined with air cooling or liquid cooling approach at the hot sideshow have great potential because of their small size, high reliability, and no noise.
