9786203589221 - suppression of radiated emission in high speed printed circuit board: using defected ground structure de malaiarasan, anandan; packianathan, rajeswari; arumugam, gobinath (9 resultados)
Suppression of Radiated Emission in High Speed Printed Circuit Board: Using Defected Ground Structure
Malaiarasan, Anandan; Packianathan, Rajeswari; Arumugam, Gobinath
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Librería: Ria Christie Collections, Uxbridge, Reino UnidoRia Christie Collections
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Suppression of Radiated Emission in High Speed Printed Circuit Board: Using Defected Ground Structure
Anandan Malaiarasan, Rajeswari Packianathan, Gobinath Arumugam
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Librería: Chiron Media, Wallingford, , Reino UnidoChiron Media
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EUR 36,79
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Paperback. Condición: New.
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Librería: preigu, Osnabrück, Alemaniapreigu
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EUR 36,25
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Taschenbuch. Condición: Neu. Suppression of Radiated Emission in High Speed Printed Circuit Board | Using Defected Ground Structure | Anandan Malaiarasan (u. a.) | Taschenbuch | Englisch | 2021 | LAP LAMBERT Academic Publishing | EAN 9786203589221 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19…, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
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Librería: PBShop.store US, Wood Dale, IL, Estados Unidos de AmericaPBShop.store US
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EUR 42,59
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PAP. Condición: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Librería: PBShop.store UK, Fairford, GLOS, Reino UnidoPBShop.store UK
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PAP. Condición: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , AlemaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 39,90
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size,…chips and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board. 64 pp. Englisch.
Suppression of Radiated Emission in High Speed Printed Circuit Board
Anandan Malaiarasan|Rajeswari Packianathan|Gobinath Arumugam
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Librería: moluna, Greven, , Alemaniamoluna
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EUR 34,25
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Kartoniert / Broschiert. Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Malaiarasan AnandanDr.M.Anandan, Assistant Professor of ECE Department of Vel Tech Rangarajan Dr. Sagunthala R&D Institute of Science and Technology, Chennai, obtained his B.E.,… degree from Madurai Kamaraj University, Madurai and M.E.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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EUR 39,90
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chip…s and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 64 pp. Englisch.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 40,89
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Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The recent advances in wireless communication and semiconductor technology led to the miniaturization of circuits, increased bandwidth, and faster speed. In order to satisfy the enormous demand of low cost and smaller feature size, chips… and transmission lines must be integrated within a constrained space in a printed circuit board which leads to signal integrity issues. Signal integrity is the measure of the quality of the electrical signal. The signal that travels in one interconnect will couple with the adjacent interconnects by means of electromagnetic coupling which may affect the timing and the quality of the signal. The most predominant signal integrity issue is a radiated emission. The unintentional release of electromagnetic energy from interconnects is called radiated emission. The significant source of radiated emission is a common mode current. The defective ground structure (DGS) is the right candidate to suppress common mode radiation on high speed printed circuit board.
