9786200093554 - cooling of discrete heat sources under natural and mixed convection de hotta, tapano kumar; venkateshan, s p; balaji, c (6 resultados)
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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Due to rapid advancement in integrated circuit technology, and increasing power dissipation, thermal management of electronics has become increasingly challenging. For reliable operation of electronic components, their operating tem…perature must not exceed about 85ºC. As the size of electronic components becomes smaller and smaller, the area available for heat dissipation also becomes smaller. This results in a dissipation of high heat flux at the chip level, thereby necessitating the development of more efficient thermal management solutions. In view of the above, it is imperative to seek the optimal distribution of heat sources mounted on a PCB, to improve the cooling rate, and thereby their reliability, and life. Discrete heat sources are individual heating elements mounted on the motherboard of computers. Often times, the PCB (FR4) is mimicked by a low thermal conductivity material, Bakelite, and the discrete heat sources or IC chips, usually made of Silicon by Aluminum. The main objective of this present study is to seek the optimal configuration of discrete heat sources mounted on the PCB board losing heat by convection and radiation. 184 pp. Englisch.
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Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Hotta Tapano KumarDr Tapano Kumar Hotta is currently working as an Associate Professor in the school of Mechanical Engineering, VIT, Vellore. He has obtained his PhD degree in Mechanical Engineering fro…m IIT Madras. His research inte.
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Taschenbuch. Condición: Neu. Cooling of Discrete Heat Sources under Natural and Mixed Convection | Tapano Kumar Hotta (u. a.) | Taschenbuch | 184 S. | Englisch | 2019 | LAP LAMBERT Academic Publishing | EAN 9786200093554 | Verantwortliche Person für die EU: LAP Lambert Academic Publishing, Brivibas Gatve 197, 1039 RIGA, LETTLAND…, customerservice[at]vdm-vsg[dot]de | Anbieter: preigu Print on Demand.
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Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemaniabuchversandmimpf2000
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Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Due to rapid advancement in integrated circuit technology, and increasing power dissipation, thermal management of electronics has become increasingly challenging. For reliable operation of electronic components, their operating tempera…ture must not exceed about 85ºC. As the size of electronic components becomes smaller and smaller, the area available for heat dissipation also becomes smaller. This results in a dissipation of high heat flux at the chip level, thereby necessitating the development of more efficient thermal management solutions. In view of the above, it is imperative to seek the optimal distribution of heat sources mounted on a PCB, to improve the cooling rate, and thereby their reliability, and life. Discrete heat sources are individual heating elements mounted on the motherboard of computers. Often times, the PCB (FR4) is mimicked by a low thermal conductivity material, Bakelite, and the discrete heat sources or IC chips, usually made of Silicon by Aluminum. The main objective of this present study is to seek the optimal configuration of discrete heat sources mounted on the PCB board losing heat by convection and radiation.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 184 pp. Englisch.
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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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Taschenbuch. Condición: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Due to rapid advancement in integrated circuit technology, and increasing power dissipation, thermal management of electronics has become increasingly challenging. For reliable operation of electronic components, their operating temperat…ure must not exceed about 85ºC. As the size of electronic components becomes smaller and smaller, the area available for heat dissipation also becomes smaller. This results in a dissipation of high heat flux at the chip level, thereby necessitating the development of more efficient thermal management solutions. In view of the above, it is imperative to seek the optimal distribution of heat sources mounted on a PCB, to improve the cooling rate, and thereby their reliability, and life. Discrete heat sources are individual heating elements mounted on the motherboard of computers. Often times, the PCB (FR4) is mimicked by a low thermal conductivity material, Bakelite, and the discrete heat sources or IC chips, usually made of Silicon by Aluminum. The main objective of this present study is to seek the optimal configuration of discrete heat sources mounted on the PCB board losing heat by convection and radiation.
