9783032256089 - dl-based multidimensional signals analysis and processing: proceedings of 7th international conference on 3d imaging technologies 2025, volume 1: 499 (smart innovation, systems and technologies, 499) (2 resultados)

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Librería: AHA-BUCH GmbH, Einbeck, AlemaniaAHA-BUCH GmbH
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EUR 267,49
Envío por EUR 63,66Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Buch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents high-quality research in the field of 3D imaging technology. This book continues the good traditions already established by the first six editions of the conference to provide a wide scientific forum for researchers, academia, and pract…itioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The book is published in two volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology.

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Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, AlemaniaBuchWeltWeit Ludwig Meier e.K.
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 267,49
Envío por EUR 23,00Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: 2 disponibles
Buch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents high-quality research in the field of 3D imaging technology. This book continues the good traditions already established by the first six editions of the conference to provide a wide scientific forum for researchers, aca…demia, and practitioners to exchange newest ideas and recent achievements in all aspects of image processing and analysis, together with their contemporary applications. The book is published in two volumes. The main topics of the papers comprise famous trends as: 3D image representation, 3D image technology, 3D images and graphics, and computing and 3D information technology. 404 pp. Englisch.