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  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer International Publishing AG, Cham, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de America

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    Paperback. Condición: new. Paperback. RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAMs potential novel applications beyond the NVM applications. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

  • Yu, Shimeng (Author)

    Idioma: Inglés

    Publicado por Springer, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: Revaluation Books, Exeter, Reino Unido

    Calificación del vendedor: 5 de 5 estrellas Valoración 5 estrellas, Más información sobre las valoraciones de los vendedores

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    Paperback. Condición: Brand New. 78 pages. 9.25x7.51x9.25 inches. In Stock.

  • Yu, Shimeng

    Idioma: Inglés

    Publicado por Springer, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: Books Puddle, New York, NY, Estados Unidos de America

    Calificación del vendedor: 4 de 5 estrellas Valoración 4 estrellas, Más información sobre las valoraciones de los vendedores

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    Condición: New. 1st edition NO-PA16APR2015-KAP.

  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer International Publishing AG, Cham, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: AussieBookSeller, Truganina, VIC, Australia

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    Paperback. Condición: new. Paperback. RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAMs potential novel applications beyond the NVM applications. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer International Publishing, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: AHA-BUCH GmbH, Einbeck, Alemania

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    Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM's potential novel applications beyond the NVM applications.

  • Imagen del vendedor de Resistive Random Access Memory (RRAM) a la venta por preigu

    Shimeng Yu

    Idioma: Inglés

    Publicado por Springer, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: preigu, Osnabrück, Alemania

    Calificación del vendedor: 5 de 5 estrellas Valoración 5 estrellas, Más información sobre las valoraciones de los vendedores

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    Taschenbuch. Condición: Neu. Resistive Random Access Memory (RRAM) | Shimeng Yu | Taschenbuch | Synthesis Lectures on Emerging Engineering Technologies | vii | Englisch | 2016 | Springer | EAN 9783031009020 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

  • Yu, Shimeng

    Idioma: Inglés

    Publicado por Springer, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: Majestic Books, Hounslow, Reino Unido

    Calificación del vendedor: 4 de 5 estrellas Valoración 4 estrellas, Más información sobre las valoraciones de los vendedores

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    Condición: New. Print on Demand.

  • Yu, Shimeng

    Idioma: Inglés

    Publicado por Springer, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: Biblios, Frankfurt am main, HESSE, Alemania

    Calificación del vendedor: 4 de 5 estrellas Valoración 4 estrellas, Más información sobre las valoraciones de los vendedores

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    Condición: New. PRINT ON DEMAND.

  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer International Publishing Mrz 2016, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania

    Calificación del vendedor: 5 de 5 estrellas Valoración 5 estrellas, Más información sobre las valoraciones de los vendedores

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    Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments and the electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM's potential novel applications beyond the NVM applications. 80 pp. Englisch.

  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer International Publishing, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: moluna, Greven, Alemania

    Calificación del vendedor: 5 de 5 estrellas Valoración 5 estrellas, Más información sobre las valoraciones de los vendedores

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    Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Shimeng Yu received his B.S. degree in microelectronics from Peking University, Beijing, China, in 2009, and his M.S. degree and Ph.D. degree in electrical engineering from Stanford University, Stanford, CA, in 2011, and 2013, respectively. He did summer in.

  • Shimeng Yu

    Idioma: Inglés

    Publicado por Springer, Palgrave Macmillan Mär 2016, 2016

    ISBN 10: 3031009029 ISBN 13: 9783031009020

    Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania

    Calificación del vendedor: 5 de 5 estrellas Valoración 5 estrellas, Más información sobre las valoraciones de los vendedores

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    Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -RRAM technology has made significant progress in the past decade as a competitive candidate for the next generation non-volatile memory (NVM). This lecture is a comprehensive tutorial of metal oxide-based RRAM technology from device fabrication to array architecture design. State-of-the-art RRAM device performances, characterization, and modeling techniques are summarized, and the design considerations of the RRAM integration to large-scale array with peripheral circuits are discussed. Chapter 2 introduces the RRAM device fabrication techniques and methods to eliminate the forming process, and will show its scalability down to sub-10 nm regime. Then the device performances such as programming speed, variability control, and multi-level operation are presented, and finally the reliability issues such as cycling endurance and data retention are discussed. Chapter 3 discusses the RRAM physical mechanism, and the materials characterization techniques to observe the conductive filaments andthe electrical characterization techniques to study the electronic conduction processes. It also presents the numerical device modeling techniques for simulating the evolution of the conductive filaments as well as the compact device modeling techniques for circuit-level design. Chapter 4 discusses the two common RRAM array architectures for large-scale integration: one-transistor-one-resistor (1T1R) and cross-point architecture with selector. The write/read schemes are presented and the peripheral circuitry design considerations are discussed. Finally, a 3D integration approach is introduced for building ultra-high density RRAM array. Chapter 5 is a brief summary and will give an outlook for RRAM¿s potential novel applications beyond the NVM applications.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 80 pp. Englisch.