EUR 139,60
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Añadir al carritoTaschenbuch. Condición: Neu. Advanced Flip Chip Packaging | Ho-Ming Tong (u. a.) | Taschenbuch | vii | Englisch | 2016 | Springer | EAN 9781489979339 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Idioma: Inglés
Publicado por Springer US, Springer US, 2016
ISBN 10: 1489979336 ISBN 13: 9781489979339
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 165,91
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
EUR 317,98
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Añadir al carritoPaperback. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
EUR 371,01
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Añadir al carritoCondición: New. pp. 567.
Librería: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 125,89
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Añadir al carritoCondición: new. Questo è un articolo print on demand.
Librería: moluna, Greven, Alemania
EUR 132,36
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Broad-ranging chapters with a focus on IC-package-system integrationProvides viewpoints from leading industry executives and expertsDetails state-of-the-art achievements in process technologies and scientific researchPresents a clear.
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 159,99
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. 568 pp. Englisch.
Idioma: Inglés
Publicado por Springer US, Springer Aug 2016, 2016
ISBN 10: 1489979336 ISBN 13: 9781489979339
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 159,99
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Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 568 pp. Englisch.
Librería: Majestic Books, Hounslow, Reino Unido
EUR 346,26
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. Print on Demand pp. 567.
Librería: Biblios, Frankfurt am main, HESSE, Alemania
EUR 342,42
Cantidad disponible: 4 disponibles
Añadir al carritoCondición: New. PRINT ON DEMAND pp. 567.