9780470250020 - structural dynamics of electronic and photonic systems (13 resultados)
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
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Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 160,93
Envío por EUR 2,31Se envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New.
Structural Dynamics of Electronic and Photonic Systems Format: Hardcover
Editor: Ephram Suhir (Los Altos, CA); Editor: T. X. Yu (Hong Kong University of Science and Technology); Editor: Eric Connally (Litton Guidance and Control Systems, Woodland Hills, California)
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Librería: INDOO, Avenel, NJ, Estados Unidos de AmericaINDOO
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EUR 163,39
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Brand New.
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- Primera edición
Librería: Grand Eagle Retail, Bensenville, IL, Estados Unidos de AmericaGrand Eagle Retail
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EUR 204,11
Gastos de envío gratisSe envía dentro de Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliabl…e structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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- Primera edición
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 220,64
Envío por EUR 10,50Se envía de Irlanda a Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Co…nnally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . .
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Librería: Ubiquity Trade, Miami, FL, Estados Unidos de AmericaUbiquity Trade
Contactar con el vendedorVendedor de 4 estrellasCondición: Nuevo
EUR 235,43
Envío por EUR 2,63Se envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: New. Brand new! Please provide a physical shipping address.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
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Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
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EUR 222,32
Envío por EUR 17,61Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: New.
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- Primera edición
Librería: CitiRetail, Stevenage, Reino UnidoCitiRetail
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EUR 225,46
Envío por EUR 43,43Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliabl…e structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Librería: moluna, Greven, Alemaniamoluna
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EUR 216,76
Envío por EUR 48,99Se envía de Alemania a Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Gebunden. Condición: New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
- Tapa dura
Librería: GreatBookPricesUK, Woodford Green, Reino UnidoGreatBookPricesUK
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Como Nuevo
EUR 257,51
Envío por EUR 17,61Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Condición: As New. Unread book in perfect condition.
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Librería: Mispah books, Redhill, SURRE, Reino UnidoMispah books
Contactar con el vendedorVendedor de 4 estrellasCondición: Usado - Como Nuevo
EUR 247,85
Envío por EUR 29,34Se envía de Reino Unido a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Structural Dynamics of Electronic and Photonic Systems
Suhir, Ephraim (EDT); Yu, T. X. (EDT); Steinberg, David S. (EDT)
- Tapa dura
Librería: GreatBookPrices, Columbia, MD, Estados Unidos de AmericaGreatBookPrices
Contactar con el vendedorVendedor de 5 estrellasCondición: Usado - Como Nuevo
EUR 283,48
Envío por EUR 2,31Se envía dentro de Estados Unidos de AmericaCantidad disponible: Más de 20 disponibles
Condición: As New. Unread book in perfect condition.
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Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 278,17
Envío por EUR 9,21Se envía dentro de Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Co…nnally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
- Tapa dura
- Primera edición
Librería: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 321,70
Envío por EUR 32,44Se envía de Australia a Estados Unidos de AmericaCantidad disponible: 1 disponibles
Hardcover. Condición: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliabl…e structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
