Yogesh singh u a (6 resultados)

Taschenbuch. Condición: Neu. Finfet/Gaa Modeling for IC Simulation and Design | Using the Bsim-Cmg Standard | Yogesh Singh Chauhan (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2024 | Elsevier Science | EAN 9780323957298 | Verantwortliche Person für die EU: Zeitfracht Medien GmbH, Ferdinand-Jühlke-Str. 7, 99095 Erfurt, produktsicherheit[at]zeitfracht[dot]de | Anbieter: preigu. …

Taschenbuch. Condición: Neu. Alternative Fuels and Their Utilization Strategies in Internal Combustion Engines | Akhilendra Pratap Singh (u. a.) | Taschenbuch | Energy, Environment, and Sustainability | xv | Englisch | 2020 | Springer | EAN 9789811504204 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Taschenbuch. Condición: Neu. Starch: Advances in Modifications, Technologies and Applications | Vijay Singh Sharanagat (u. a.) | Taschenbuch | viii | Englisch | 2024 | Springer | EAN 9783031358456 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condición: Neu. Recent Advancements in Design and Automation | Select Proceedings of ICRAME 2025 | Yogesh Singh (u. a.) | Taschenbuch | Lecture Notes in Mechanical Engineering | x | Englisch | 2026 | Springer | EAN 9789819539741 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Taschenbuch. Condición: Neu. Digital and Social Media Marketing | Emerging Applications and Theoretical Development | Nripendra P. Rana (u. a.) | Taschenbuch | Advances in Theory and Practice of Emerging Markets | xv | Englisch | 2020 | Springer | EAN 9783030243760 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

paperback. Condición: New. Language:Chinese.Paperback. Pub Date: 2020-10-01 Publisher: Machinery Industry Press As the feature size of integrated circuits enters the node below 28nm. the traditional planar MOSFET structure is no longer applicable. and the new three-dimensional transistor (FinFET) structure has gradually become Moore's Law An important guarantee for continuation.?This book starts with the principles and physical effects of the three-dimensional structure. and discusses in detail the background. principl. …