Electronic packaging production (15 resultados)

Hardcover. Condición: UsedAcceptable. Hardcover; conference held June 8-10, 1965, in Long Beach, California; surp lus library copy with the usual stampings; reference number taped to spine; cloth at spine has been torn and repaired; fading and edge wear to exterio r; otherwise in acceptable condition with clean text.…

gebundene Ausgabe. Condición: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.…

Condición: New.

Condición: New. In English.

Taschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.…

Condición: New. pp. 628.

Paperback. Condición: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.

Condición: As New. Unread book in perfect condition.

Condición: gut. 1988. The Electronics Assembly Handbook. In deutscher Sprache. pages.

Condición: new. Questo è un articolo print on demand.

Condición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.…

Taschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.…

Taschenbuch. Condición: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.…

Condición: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam.

Condición: New. PRINT ON DEMAND pp. 628.