Publicado por Industrial and Scientific Conference Management, 1965
Librería: BookDepart, Shepherdstown, WV, Estados Unidos de America
EUR 30,78
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Añadir al carritoHardcover. Condición: UsedAcceptable. Hardcover; conference held June 8-10, 1965, in Long Beach, California; surplus library copy with the usual stampings; reference number taped to spine; cloth at spine has been torn and repaired; fading and edge wear to exterior; otherwise in acceptable condition with clean text.
Librería: books4less (Versandantiquariat Petra Gros GmbH & Co. KG), Welling, Alemania
EUR 127,00
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Añadir al carritogebundene Ausgabe. Condición: Gut. 603 Seiten; Das hier angebotene Buch stammt aus einer teilaufgelösten wissenschaftlichen Bibliothek und trägt die entsprechenden Kennzeichnungen (Rückenschild, Instituts-Stempel.); Schnitt und Einband sind etwas staubschmutzig; der Buchzustand ist ansonsten ordentlich und dem Alter entsprechend gut. Text in ENGLISCHER Sprache! Sprache: Englisch Gewicht in Gramm: 1600.
Librería: Lucky's Textbooks, Dallas, TX, Estados Unidos de America
EUR 184,86
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Añadir al carritoCondición: New.
EUR 194,32
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Añadir al carritoCondición: New. In.
Idioma: Inglés
Publicado por Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Librería: buchversandmimpf2000, Emtmannsberg, BAYE, Alemania
EUR 192,59
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Añadir al carritoTaschenbuch. Condición: Neu. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch.
Idioma: Inglés
Publicado por Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Librería: AHA-BUCH GmbH, Einbeck, Alemania
EUR 192,59
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Añadir al carritoTaschenbuch. Condición: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
EUR 279,96
Cantidad disponible: 2 disponibles
Añadir al carritoPaperback. Condición: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock.
EUR 289,77
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Añadir al carritoPaperback. Condición: Like New. Like New. book.
Idioma: Inglés
Publicado por Springer Berlin Heidelberg, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Librería: moluna, Greven, Alemania
EUR 162,51
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Añadir al carritoCondición: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect.
Idioma: Inglés
Publicado por Springer Berlin Heidelberg Okt 2013, 2013
ISBN 10: 3662131633 ISBN 13: 9783662131633
Librería: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Alemania
EUR 192,59
Cantidad disponible: 2 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch.
Librería: preigu, Osnabrück, Alemania
EUR 168,50
Cantidad disponible: 5 disponibles
Añadir al carritoTaschenbuch. Condición: Neu. The Electronics Assembly Handbook | Electronic Packaging and Production (u. a.) | Taschenbuch | xix | Englisch | 2013 | Springer-Verlag GmbH | EAN 9783662131633 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.