Ed s balde john w (2 resultados)
- Tapa dura
Librería: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 202,79
Envío por EUR 9,50Se envía de Irlanda a Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . .…
- Tapa dura
Librería: Kennys Bookstore, Olney, MD, Estados Unidos de AmericaKennys Bookstore
Contactar con el vendedorVendedor de 5 estrellasCondición: Nuevo
EUR 261,56
Envío por EUR 9,34Se envía dentro de Estados Unidos de AmericaCantidad disponible: 15 disponibles
Condición: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . . Books ship from the US and Ireland.…
