Cho jun (97 resultados)

Hardcover. Condición: Very Good. 2nd Edition. Red cloth covered boards with black lettering at the front and at the spine. Front board has a small scuff in the middle by the spine. Book pages are clean with no marks. Bookseller Inventory BS/BS 11487 06/2021.

Condición: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condición: New. pp. 220.

Condición: New. pp. 220.

hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

hardcover. Condición: As New. Hardback--no flaws.

Hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condición: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condición: New. Brand new book, sourced directly from publisher. Dispatch time is 9-10 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Hardcover. Condición: New. Brand new book, sourced directly from publisher. Dispatch time is 6-7 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

hardcover. Condición: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condición: Very good+. no dust jacket. 2nd edition.

Hardcover. Condición: Very good+. no dust jacket. 2nd Edition.

brosch , guter Zustand , 200 S.

Copertina flessibile. Condición: New. Witch Hunter (Vol. 3) di Jun-Man Cho. Condizioni: Nuovo. Spedizione rapida e curata.

Condición: New.

Condición: As New. Unread book in perfect condition.

Hardback. Condición: New.

Condición: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.…

Condición: New.

Condición: Very Good +. No dust jacket. 3rd Edition.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: As New. Unread book in perfect condition.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condición: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condición: New. pp. xv + 361.

Condición: New. pp. xv + 361 Illus.

Condición: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Hardcover. Condición: New. Brand new book, sourced directly from publisher. Dispatch time is 24-48 hours from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Hardcover. Condición: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…