Guidebook for Managing Silicon Chip Reliability (Electronic Packaging)

Pecht, Michael, Radojcic, Riko, Rao, Gopal

ISBN 10: 0849396247 ISBN 13: 9780849396243
Editorial: CRC Press, 1998
Usado Hardcover

Librería: Mispah books, Redhill, SURRE, Reino Unido Calificación del vendedor: 4 de 5 estrellas Valoración 4 estrellas, Más información sobre las valoraciones de los vendedores

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Like NewLIKE NEW. N° de ref. del artículo ERICA84208493962473

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Sinopsis:

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

  • failure sites, operational loads, and failure mechanism
  • intrinsic device sensitivities
  • electromigration
  • hot carrier aging
  • time dependent dielectric breakdown
  • mechanical stress induced migration
  • alpha particle sensitivity
  • electrostatic discharge (ESD) and electrical overstress
  • latch-up
  • qualification
  • screening
  • guidelines for designing reliability

    Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
  • Acerca del autor: Pecht, Michael; Radojcic, Riko; Rao, Gopal

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    Detalles bibliográficos

    Título: Guidebook for Managing Silicon Chip ...
    Editorial: CRC Press
    Año de publicación: 1998
    Encuadernación: Hardcover
    Condición: Like New
    Tipo de libro: book

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