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DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS: 2 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING) - Tapa dura

Libro 2 de 7: WSPC Series in Advanced Integration and Packaging

HAN, KI JIN; SWAMINATHAN, MADHAVAN; MADHAVAN SWAMINATHAN & KI JIN HAN

 
9789814508599: DESIGN AND MODELING FOR 3D ICS AND INTERPOSERS: 2 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)
Tapa dura
ISBN 10: 9814508594 ISBN 13: 9789814508599
Editorial: World Scientific, 2013

Sinopsis

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

"Sinopsis" puede pertenecer a otra edición de este libro.

De la contraportada

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
World Scientific
Año de publicación
2013
Idioma
Inglés
ISBN 10 
9814508594
ISBN 13 
9789814508599
Encuadernación
Tapa dura
Número de páginas
380
Contacto del fabricante
no disponible
Persona responsable
gpsr@libri.de
gpsr@libri.de

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