Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology) - Tapa blanda

Tan, Cher Ming

 
9789814451208: Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)
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ISBN 10: 9814451207 ISBN 13: 9789814451208
Editorial: Springer, 2013

Sinopsis

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

"Sinopsis" puede pertenecer a otra edición de este libro.

Acerca del autor

Charlotte y Peter Fiell son dos autoridades en historia, teoría y crítica del diseño y han escrito más de sesenta libros sobre la materia, muchos de los cuales se han convertido en éxitos de ventas. También han impartido conferencias y cursos como profesores invitados, han comisariado exposiciones y asesorado a fabricantes, museos, salas de subastas y grandes coleccionistas privados de todo el mundo. Los Fiell han escrito numerosos libros para TASCHEN, entre los que se incluyen 1000 Chairs, Diseño del siglo XX, El diseño industrial de la A a la Z, Scandinavian Design y Diseño del siglo XXI.

De la contraportada

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

"Sobre este título" puede pertenecer a otra edición de este libro.

Editorial
Springer
Año de publicación
2013
Idioma
Inglés
ISBN 10 
9814451207
ISBN 13 
9789814451208
Encuadernación
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Número de páginas
116
Contacto del fabricante
ProductSafety@springernature.com
ProductSafety@springernature.com

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Darmstadt
64293
Alemania

Otras ediciones populares con el mismo título

9789814451222: Electromigration Modeling at Circuit Layout Level

Edición Destacada

ISBN 10:  9814451223 ISBN 13:  9789814451222
Editorial: Springer, 2013
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